Member Research Publication Lectures Notice

Journal
International -
Domestic -
Conference Proceedings
International -
Domestic -
Talks
International -
Domestic -
Patents
Journal
/ International
> Publication > Journal
   1990-2000
1 H. M. Lee, "Design of High-Temperature High-Strength Al-Ti-V-Zr Alloys", Scripta Metall., vol. 24, no. 12, pp. 2443-2446 (1990).
2 H. M. Lee, S. M. Allen and M. Grujicic, "Coarsening Resistance of M2C Carbides in Secondary Hardening Steels, Part I : Theoretical Model for Multicomponent Coarsening Kinetics", Metall. Trans., vol. 22A, no. 12, p. 2863-2868 (1991).
3 H. M. Lee, S. M. Allen and M. Grujicic, "Coarsening Resistance of M2C Carbides in Secondary Hardening Steels, Part II : Alloy Design aided by a Thermochemical Database", Metall. Trans., vol. 22A, no. 12, pp. 2869-2876 (1991).
4 H. M. Lee and S. M. Allen, "Coarsening Resistance of M2C Carbides in Secondary Hardening Steels, Part III : Comparison of Theory and Experiment", Metall. Trans., vol. 22A, no. 12, pp. 2877-2888 (1991).
5 H. M. Lee, J. Lee and Z.-H. Lee, "Lattice Misfit Variation of Al3(Ti,V,Zr) in Al-Ti-V-Zr Alloys", Scripta Metall.,vol. 25, no. 3, pp. 517-520 (1991).
6 H. M. Lee, A. J. Garratt-Reed and S. M. Allen, "Composition of M2C Phase in Tempering of High Co-Ni Steels", Scripta Metall., vol. 25, no. 3, pp. 685-688 (1991).
7 H. M. Lee and W.-J. Lee, "Poisson's Ratio of Pure Metals and their Non-Metallic Compounds", Scripta Metall., vol. 25, no. 4, pp. 965-968 (1991).
8 H. M. Lee and H. Lee, "Site Fraction Behavior of Transition Elements in Al3(Ti,V,Zr) P hase", CALPHAD, vol. 16, no. 1, pp. 19-24 (1992).
9 H. M. Lee, "Interaction Parameters of Lead-Base Ternary Systems", CALPHAD, vol. 16, no. 1, pp. 47-52 (1992).
10 H. M. Lee, "Design of Al3(Ti,V,Zr) Systems through Phase Stability Calculations", Mater. Sci. Eng. , vol. A152,no. 1, pp. 26-30 (1992).
11 J. W. Soh and H. M. Lee, "Poisson's Ratios versus Ionicities of Metal-Nonmetal Compounds", Scripta Metall., vol. 27, no. 7, pp. 783-788 (1992).
12 J. W. Soh, H. M. Lee and H.-S. Kwon, "Relation between Poisson's Ratio and Ionicity in Simple Binary Cubic Compounds", J. Alloy. Compd., vol. 194, no. 1, pp. 119-125 (1993).
13 H. Lee, S. Z. Han, H. M. Lee and Z.-H. Lee, "Coarsening Behavior of L12 Precipitates in Melt-Spun Al-Ti-V-r Alloys", Mater. Sci. Eng. , vol. A163, no. 1, pp. 81-90 (1993).
14 H. M. Lee, J.-R. Soh, Z.-H. Lee and Y.-S. Kim, "Effect of Alloying Composition on Volume Fraction of Beta  Phase in Duplex Titanium Alloys", Scripta Metall., vol. 29, no. 4, pp. 497-501 (1993).
15 J.-R. Soh, H. M. Lee and H.-S. Kwon, "Thermodynamic Evaluation and Phase Diagram of the PbO-TiO2 System", CALPHAD, vol. 18, no. 3, pp. 237-244 (1994).
16 S. Z. Han, H. M. Lee and H.-S. Kwon, "Bonding Structure and Optical Bandgap of rf-Sputtered Hydrogenated Amorphous Silicon Carbide Alloy Films", J. Non-Crystalline Solids, vol. 170, no. 2, pp. 199-204 (1994).
17 S. Z. Han, S. C. Chung and H. M. Lee, "Alloy Design and Coarsening Phenomenon of L12 Precipitates in  High-Temperature Al-2at%(Ti,V,Zr) Systems", Metall. Trans., vol. 26A, no. 7, pp. 1633-1639 (1995).
18 S. C. Chung, S. Z. Han, H. M. Lee and H.-S. Kwon, "Coarsening Phenomenon of L12 Precipitates in Rapidly Solidified Al-3at%(Ti,V,Zr) System", Scripta Metall., vol. 33, no. 5, pp. 687-693 (1995).
19 S. Z. Han, B. S. Rho, H. M. Lee and S. K. Choi, "Effect of Alloyed Ti:Zr Ratio on Phase Stability of  Al66Mn9(Ti,Zr)25 Intermetallic Compounds", Intermetallics, vol. 4, no. 3, pp. 245-249 (1996).
20 C. H. Yoo, H. M. Lee, J. W. Chan and J. W. Morris, Jr., "M2C Precipitates in Isothermal Tempering of High Co-Ni Secondary Hardening Steel", Metall. Trans., vol. 27A, no. 11, pp. 3466-3472 (1996).
21 S. I. Park , S. Z. Han, S. K. Choi and H. M. Lee, "Phase Equilibria of Al3(Ti,V,Zr) Intermetallic System", Scripta Mater., vol. 34, no. 11, pp. 1697-1704 (1996).
22 J.-R. Soh and H. M. Lee, "Phenomenological Calculation of Phase Diagram of the Ni-Al System in the Ni-Rich Region", Acta Mater., vol. 45, no. 11, pp. 4743-4749 (1997).
23 S. W. Yoon, J.-R. Soh, H. M. Lee and B.-J. Lee, "Thermodynamics-Aided Alloy Design and Evaluation of New Pb-Free Solder, Sn-Bi-In-Zn System", Acta Mater., vol. 45, no. 3, pp. 9 51-960 (1997).
24 B.-J. Lee, N.-M. Hwang and H. M. Lee, "Prediction of Interface Reaction Products between Cu and Various Solder Alloys by Thermodynamic Calculation", Acta Mater., vol. 45, no. 5, pp. 1867-1874 (1997).
25 S. Z. Han, S. I. Park , J.-S. Huh, Z.-H. Lee and H. M. Lee, "Lattice Matching of D023 and D022 Phases in Al- 6at%(Ti,V,Zr) Systems", Mater. Sci. Eng. , vol. 230A, no. 1, pp. 100-106 (1997).
26 S. I. Park , S. Z. Han, Z.-H. Lee and H. M. Lee, "A Correction to Optimum Alloy Composition for Design of  High-Temperature High-Strength Al-Ti-V-Zr Alloys through Thermodynamic Calculat ions", Scripta Mater., vol. 37, no. 1, pp. 93-97 (1997).
27 C.-U. Kim, J. W. Morris, Jr. and H. M. Lee, "Kinetics of Electromigration-Induced Edge D rift in Al-Cu Thin-Film Interconnects", J. Appl. Phys., vol. 82, no. 4, pp 1592-1598 (1997).
28 H. M. Lee, H. Sohn and C. H. Yoo, "Isothermal M2C Carbide Growth in Ultrahigh Strength High Co-Ni Steels", Scripta Mater., vol. 37, no. 12, pp. 1931-1937 (1997).
29 H. Lee, C. H. Yoo and H. M. Lee, "The Effect of W Additions on Simulated Heat-Affected Zone Toughness in 25Cr-Base Super Duplex Stainless Steels", Mater. Sci. and Tech., vol. 14, no. 1, pp. 54-60 (1998).
30 H. M. Lee, J. S. Bae, J. R. Soh, S. K. Kim and Y. D. Lee, "Diffusional Solidification Behavior in 304 Stainless Steel", Mater. Trans. JIM, vol. 39, no. 6, pp. 633-639 (1998).
31 M. K. Ahn, H.-S. Kwon and H. M. Lee, "Quantitative Comparison of the Influences of W and Mo on the Passivity of Fe-29Cr Ferritic Stainless Steels", Corros. Sci., vol. 40, no. 2/3, pp. 307-322 (1998).
32 H. M. Lee, S. W. Yoon and B.-J. Lee, "Thermodynamic Prediction of Interface Reaction Phases at Cu/Solder Joints", J. Electron. Mater., vol. 27, no. 11, pp. 1161-1166 (1998).
33 Y. K. Kim, J.-R. Soh, H. S. Kim and H. M. Lee, "Thermodynamic Prediction of Glass Forming Range in Al-Mg-REM Ternary System", CALPHAD, vol. 22, no. 2, pp. 221-230 (1998).
34 S. W. Yoon and H. M. Lee, "A Thermodynamic Study of Phase Equilibria in the Sn-Bi-Pb Solder System",  CALPHAD, vol. 22, no. 2, pp. 167-178 (1998).
35 Y. K. Kim, J.-R. Soh, D. K. Kim and H. M. Lee, "Glass Formation in Metallic Al-Ni-Y", J. Non-Crystalline Solids, Vol. 242, no. 2-3, pp. 122-130 (1998).
36 S. W. Yoon, W. K. Choi and H. M. Lee, "Calculation of Surface Tension and Wetting Properties of Sn-based Solder Alloys", Scripta Mater., vol. 40, no. 3, pp. 297-302 (1999).
37 S. W. Yoon, W. K. Choi and H. M. Lee, "Interfacial Reaction between Sn-1Bi-5In-9Zn Solder and Cu Substrate", Scripta Mater., vol. 40, no. 3, pp. 327-332 (1999).
38 J.-R. Soh and H. M. Lee, "Investigation of Thermodynamic Stability in the Phase Separating Thin Film using CVM", Zeit. Metall., vol. 90, no. 1, pp. 50-54 (1999).
39 S. W. Yoon, B.-S. Rho , H. M. Lee, C.-U. Kim and B.-J. Lee, "Investigation of the Phase Equilibria in the Sn-Bi-In Alloy System", Metall. Trans., vol. 30A, no. 6, pp. 1503-1515 (1999).
40 J. Y. Lee, J. H. Kim, S. I. Park and H. M. Lee, "Phase Equilibria of the Ti-Cr-V Ternary System in the Non-Burning b Ti-Rich Region", J. Alloy. Compd., vol. 291, no. 1-2, pp. 229-238 (1999).
41 W. K. Choi and H. M. Lee, "Effect of Ni Layer Thickness and Soldering Time on Intermetallic Compound Formation at the Interface between Molten Sn-3.5Ag and Ni/Cu Substrate", J. Electron. Mater., vol. 28, no.11, pp. 1251-1255 (1999)
42 W. K. Choi, S. K. Choi and H. M. Lee, "Relationship between Domain Structure and Film Thickness  in Epitaxial PbTiO3 Films deposited on MgO(001) by Reactive Sputtering", J. Mater. Res., vol. 14, no. 12,pp. 4677-4684 (1999).
43 J. Y. Lee, J. H. Kim and H. M. Lee, "Effect of Mo and Nb on Phase Equilibrium of the Ti-Cr-V Ternary System in the Non-Burning b-Ti Alloy Region", J. Alloy. Compd., vol. 297, no. 1-2, pp. 231-239 (2000).
44 S. W. Jeong, Z.-H. Lee and H. M. Lee, "Effect of Si and Mn Additions on Ferrite and Austenite Phase Fractions in 25Cr-7Ni-1.5Mo-3W Base Super Duplex Stainless Steels (SDSS)", Zeit. Metall., vol. 91, no. 6, pp. 494-499 (2000).
45 S. R. Kim, S. K. Choi and H. M. Lee, "Non-Steady-State Photovoltaic Current in (Pb0.85La0.15)TiO3 and BaTiO3 Ceramics", J. Mater. Res., vol. 15, no. 6, pp. 1354-1357 (2000).
46 W. K. Choi and H. M. Lee, "Effect of Soldering and Aging Time on Interfacial Microstructure and Growth of  Intermetallic Compounds between Sn-3.5Ag Solder Alloy and Cu Substrate", J. Electron. Mater., vol. 29, no.10, pp. 1207-1213 (2000).
47 J. S. Bae, J. H. Yu, H. M. Lee and B.-J. Lee, "Assessment of the Mobilities of Mn in Fe-Mn and Ni-Mn Binary Systems", Zeit. Metall., vol. 91, no. 8, pp. 672-674 (2000).
   2001-2010
 48 J. H. Yu, J. S. Shin, J. S. Bae, Z.-H. Lee, T. D. Lee, H. M. Lee and E. J. Lavernia, "The Effect of Heat Treatments and Si Contents on B2 Ordering Reaction in High Silicon Steels", Mat. Sci. Eng., vol. A307, no. 1-2, pp. 29-34 (2001).
 49 W. K. Choi, S. W. Yoon and H. M. Lee, "Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate", Mater. Trans., vol. 42, no. 5, pp. 783-789 (2001).
 50 S. I. Park , B.-J. Lee and H. M. Lee, "Estimation of Order-Disorder Transition Temperature in Pt-Co Alloy by Monte Carlo Simulation Using Modified Embedded Atom Method", Scripta Mater., vol. 45, no. 5, pp.495-502 (2001).
 51 W. K. Choi and H. M. Lee, "Prediction of Primary Intermetallic Compound Formation during Interfacial Reaction between Sn-based Solder and Ni Substrate", Scripta Mater., vol. 46, no. 11, pp. 777-781 (2002).
 52 W. K. Choi, J. H. Kim, S. W. Jeong and H. M. Lee, "Interfacial Microstructure and Joint Strength of Sn-3. 5Ag-X (X=Cu, In and Ni) Solder Joint", J. Mater. Res., vol. 17, no. 1, pp. 43-51 (2002).
 53 J. S. Bae, K. H. Shin, T. D. Lee and H. M. Lee, "Study of the effect of natural oxidation and thermal annealing on microstructures of AlOx in the magnetic tunnel junction by high-resolution transmission electron microscopy", Appl. Phys. Lett., vol. 80, no. 7, pp. 1168-1170 (2002).
 54 J. S. Bae, K. H. Shin and H. M. Lee, "Microstructural Observation on Effect of Oxidation Method of AlOx in  Magnetic Tunnel Junction by HRTEM", J. Appl. Phys., vol. 91, no. 10, pp. 7947-7949 (2002).
 55 W. K. Choi, S.-Y. Jang, J. H. Kim, K.-W. Paik and H. M. Lee, "Grain Morphology of Intermetallic Compounds   at Solder Joints", J. Mater. Res., vol. 17, no. 3, pp. 597-599 (2002).
 56 H. J. Kim, J. S. Bae, T. D. Lee and H. M. Lee, "Effect of Sputtering Condition and Heat Treatment in Co/Cu/Co/FeMn Spin Valve", J. Magn. Mag. Mater., vol. 241, no. 2-3, pp. 173-178 (2002).
 57 J. H. Kim, S. W. Jeong and H. M. Lee, "A Thermodynamic Study of Phase Equilibria in the Au-Sb-Sn Solder System", J. Electron. Mater., vol. 31, no. 6, pp. 557-563 (2002).
 58 J. H. Kim, S. W. Jeong and H. M. Lee, "Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications", Mater. Trans., vol. 43, no. 8, pp. 1873-1878 (2002).
 59 S. I. Park, S. S. Han, H. G. Kim, J. K. Park and H. M. Lee, "Three-Dimensional Monte-Carlo Simulation of Grain Growth in Pt-Co Thin Film", J. Electron. Mater., vol. 31, no. 10, pp. 965-971 (2002).
 60 S. W. Yoon, J. H. Kim, S. W. Jeong and H. M. Lee, "Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy", Mater. Trans.,vol.44, no. 2, pp. 290-297 (2003).
 61 J. K. Park, J. H. Kim, S. I. Park, H. M. Lee and D. Y. Oh, "Evolution of Grain Structure of As-deposited Cr Thin Film with Deposition Temperature", Scripta Mater., vol. 48, no. 8, pp. 1161-1166 (2003).
 62 J. H. Yu, H. M. Lee, M. Hayashi, M. Oogane, T. Daibou, H. Nakamura, H. Kubota, Y. Ando and T. Miyazaki,"Magnetic Tunnel Junctions with High Magnetoresistance and Small Bias Voltage Dependence using Epitaxial NiFe(111) Ferromagnetic Bottom Electrodes", J. Appl. Phys., vol. 93, no. 10, pp. 8555-8557 (2003).
 63 J. H. Yu, H. M. Lee, Y. Ando and T. Miyazaki, "Electron Transport Properties in Magnetic Tunnel Junctions with Epitaxial NiFe (111) Ferromagnetic Bottom Electrodes", Appl. Phys. Lett., vol. 82, no. 26, pp. 4735-4737 (2003).
 64 S. W. Jeong, J. H. Kim and H. M. Lee, "Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging", Mater. Sci. Forum, vol. 426-432, pp. 4081-4086 (2003).
 65 J. H. Kim, S. W. Jeong, H. D. Kim and H. M. Lee, "Morphological Transition of Interfacial Ni3Sn4 Grains at Sn-3.5Ag/Ni Joint", J. Electr
 66 J. W. Nah, J. H. Kim, K. W. Paik and H. M. Lee, "Electromigration in Flip Chip Solder Bump of 97Pb-Sn/37Pb-63Sn Combination Structure", Acta Mater., vol. 52, pp. 129-136 (2004).
 67 S. S. Han, K. S. Lee and H. M. Lee, "Nucleation Mechanism of Carbon Nanotube", Chem. Phys. Lett.vol. 383, pp. 321-325 (2004).
 68 J. H. Kim, S. W. Jeong and H. M. Lee, "Abnormal Grain Growth of Ni3Sn4 at Solder Interface", Mater. Trans.vol. 45, no. 3, pp. 710-713 (2004).
 69 S. S. Han, K. S. Lee and H. M. Lee, "Study on Cap Closure Mechanism of Single-Walled Carbon Nanotubes by Molecular Dynamics", Mater. Trans., vol. 45, no. 5, pp. 1437-1441 (2004).
 70 T. Y. Kim, S. S. Han and H. M. Lee, "Nanomechanical Behavior of %b-SiC Nanowire in Tension: Molecular Dynamic Simulations", Mater. Trans., vol. 45, no. 5, pp. 1442-1449 (2004).
 71 S. S. Han and H. M. Lee, "Adsorption Properties of Hydrogen on (10,0) Single-Walled Carbon Nanotube through Density Functional Theory", Carbon, vol. 42, pp. 2169-2177 (2004).
 72 S. W. Jeong, J. H. Kim and H. M. Lee, "Effect of Cooling Rate on Growth of IMC and Fracture Mode of Near-Eutectic Sn-Ag-Cu / Cu Pad: Before and After Aging", J. Electron. Mater., vol. 33, no. 12, pp. 1530-1544 (2004).
 73 E. S. Noh and H. M. Lee, " Exchange-Bias of NiFe/NiO Bilayer ", Mater. Sci. Forum, vol. 475-479, pp. 2231-2234 (2005).
 74 H.G. Kim and H.M.Lee, "Study of the Effect of Heat Treatment on a Pt-Co Thin Film by Monte Carlo Simulations coupled with a Modified Embedded Atom Method",Zeit. Metall, vol.96,no. 2, pp.211-215(2005).
 75 S.S. Han, J. K. Kang, A. C. T. van Duin,W. A Goddard and H.M. Lee, "Liquefaction of H2  Molecules upon Exterior Surfaces of Carbon Nanotube Bundles", Appl. Phys. Lett, vol.86,no. 20, pp. 203108 - 203110(2005).
 76 S.S. Han, A.C.T. van Duin, W.A. Goddard and H.M.Lee, "Optimization and Application of Lithium Parameters for the Reactive Force Field,",J.Phys.Chem.A,vol.109, no.20,pp. 4575 -4582(2005).
 77 S. S. Han, J. K. Kang, H. M. Lee, A. C. T. van Duin and W. A. Goddard III, "The Theoretical Study on Interaction of Hydrogen with Single-walled Boron Nitride Nanotubes: Part I. The Reactive Force Field ReaxFFHBN Development", J. Chem. Phys., vol. 123, no. 11, pp. 114703/1-114703/8 (2005).
 78 S. S. Han, J. K. Kang, H. M. Lee, A. C. T. van Duin and W. A. Goddard III, "The Theoretical Study on Interaction of Hydrogen with Single-walled Boron Nitride Nanotubes: Part II. Collision, Storage, and Adsorption", J. Chem. Phys., vol. 123, no. 11, pp. 114704/1-114704/7 (2005).
 79 S. S. Han, S. H. Lee, J. K. Kang and H. M. Lee, "High Coverage of Hydrogen on a (10,0) Single-Walled Boron Nitride Nanotube", Phys. Rev. B, vol. 72, no. 11, pp. 113402/1-113402/4 (2005).
 80 S. S. Han, H. S. Kim, K. S. Han, J. Y. Lee, H. M. Lee, J. K. Kang, S. I. Woo, A. C. T. van Duin and W. A. Goddard III, "Nanopores of Carbon Nanotubes as Practical Hydrogen Storage Media", Appl. Phys. Lett., vol. 87, no. 21, pp. 213113/1-213113/3 (2005).
81 J. S. Shin, J. S. Bae, H. J. Kim, H. M. Lee, T. D. Lee, E. J. Lavernia and Z.-H. Lee, "Ordering-Disordering Phenomena and Micro-Hardness Characteristics of B2 Phase in Fe-(5-6.5%)Si Alloys", Mat. Sci. Eng. vol. A407, pp. 282-290 (2005).
82 J.-W. Lee, Z.-H. Lee and H. M. Lee, "Formation of Intermetallics in the Ni bearing Lead free and Composite Solders", Mater. Trans., vol. 46, no. 11, pp. 2344-2350 (2005).
83 S. S. Kim, J. H. Kim, S. W. Booh, T.-G. Kim and H. M. Lee, "Microstructural Evolution of Joint Interface between Eutectic 80Au-20Sn Solder and Under Bump Metallurgy", Mater. Trans., vol. 46, no. 11, pp. 2400-2405 (2005).
84 M. G. Cho, K. W. Paik, H. M. Lee, S. W. Booh and T. G. Kim, "Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion Au Under Bump Metallurgy during Aging", J. Electron. Mater., vol. 35, no. 1, pp. 35-40 (2006).
85 H. Y. Kim, S. W. Han, H. M. Lee, "The influence of Mn and Cr on the tensile properties of A3560.20Fe alloy", Mater. Lett., vol. 60, no. 15, pp. 1880-1883 (2006).
86 H. Y. Kim, T. Y. Park, S. W. Han , H. M. Lee, "Effects of Mn on the crystal structure of a-Al(Mn,Fe) Si particles in A356 alloys", J. Cryst. Growth, vol. 291, no. 1, pp. 207-211 (2006).
87 Waldemar Wołczyski, Edward Guzik, Jolanta Janczak-Rusch, Dariusz Kopyciski, Jerzy Golczewski, Hyuck Mo Lee, Jacenty Kloch, "Morphological characteristics of multi-layer/substrate systems", Mater. Charact., vol. 56, no. 4-5, pp. 274-280 (2006).
88 S. K. Seo, M. G. Cho, W. K. Choi, and H. M. Lee "Comparison of Sn2.8Ag20In and Sn10Bi10In Solders for Intermediate Step Soldering" J. Electron. Mater., vol. 35, no. 11, pp. 1975-1981 (2006).
89 E. S. Noh, S. E. Ulloa and H. M. Lee, "Finite Element Method Study for the Spin-Polarized Transport ina Hybrid Spin Valve", J. Magn. Mag. Mater., vol. 310, no. 2, pp. 1889-1891 (2007).
90 H. Y. Kim, S. H. Lee, H. G. Kim, J. H. Ryu and H. M. Lee, " Molecular Dynamic Simulation of Coalescence between Ag and Pd Clusters ", Mater. Trans., vol. 48, no. 3, pp. 455-459 (2007).
91 H. Y. Kim, H. G. Kim, J. H. Ryu and H. M. Lee, " Preferential Segregation of Pd Atoms in the Ag-Pd Bimetallic Cluster: Density Functional Theory and Molecular Dynamics Simulation ", Phys. Rev. B, vol. 75, no. 21, pp. 212105/1-212105/4 (2007).
92 M. G. Cho, S. K. Kang, D.-Y. Shih and H. M. Lee, " Effects of Minor Addition of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging ", J. Electron. Mater., vol. 36, no. 11, pp. 1501-1509 (2007).
93 S.-K. Seo, M. G. Cho and H. M. Lee, " Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System ", J. Electron. Mater., vol. 36, no. 11, pp. 1536-1544 (2007).
94 E. S. Noh, S. E. Ulloa and H. M. Lee, " The Solid to Liquid Transition Region of the Ag-Pd Bimetallic Nanocluster ", phys. stat. sol. (b), vol. 244, no. 12, pp. 4427-4430 (2007).
95 D. H. Kim, H. Y. Kim, H. G. Kim, J. H. Ryu, and H. M. Lee, " The Solid to Liquid Transition Region of the Ag-Pd Bimetallic Nanocluster ", J. Phys-Condens. Mat., vol. 20, no. 3, pp. 035208/1-035208/5 (2008).
96 Y.-H. Jo, J. W. Lee, S.-K. Seo, H. M. Lee, H. Han and D. C. Lee, " Demonstration and Characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag Combination Solder for 3-D Multi-Stacking ", J. Electron. Mater., vol. 37, no. 1, pp. 110-117 (2008).
97 C. J. Yang, M. G. Cho and H. M. Lee, " Synthesis of the Combination Solder of 80Au-20Sn/42Sn-58Bi and Thermodynamic Interpretation of the Microstructural Evolution ", Mater. Trans., vol. 49, no. 2, pp. 376-381 (2008).
98 S. H. Lee, S. S. Han, J. K. Kang, J. H. Ryu and H. M. Lee, " Stability of Pt Nanoclusters and the Effect of (0001) Graphite Surface through Molecular Dynamics Simulation ", Surf. Sci., vol. 602, no. 7, pp. 1433-1439 (2008).
99 M. G. Cho, S. K. Kang and H. M. Lee, " Undercooling and Microhardness of Pb-free Solders on Various UBMs ", J. Mater. Res., vol. 23, no. 4, pp. 1147-1154 (2008).
100 H. G. Kim, S. K. Choi and H. M. Lee, " New Algorithm in the Basin Hopping Monte Carlo to find the Global Minimum Structure of Unary and Binary Metallic Nanoclusters ", J. Chem. Phys., vol. 128, no. 14, pp. 144702/1-144702/4 (2008).
101 E. S. Noh, S.-C. Lee, S. E. Ulloa and H. M. Lee, " A Theoretical Study of the Spin-Polarized Transport and the Giant Magnetoresistance: the Effect of the Number of Layers in a Magnetic Multilayer ", J. Appl. Phys., vol. 103, no. 8, pp. 083903/1-083903/8 (2008).
102 H. Y. Kim, H. M. Lee, R. G. S. Pala, V. Shapovalov and H. Metiu, " CO Oxidation by Rutile TiO2(11) doped with V, W, Cr, Mo and Mn ", J. Phys. Chem. C, vol. 112, no. 32, pp. 12398-12408 (2008).
103 H. Y. Kim, H. G. Kim, D. H. Kim and H. M. Lee, " Overstabilization of the Metastable Structure of Isolated Ag-Pd Bimetallic Clusters ", J. Phys. Chem. C, vol. 112, no. 44, pp. 17138-17142 (2008).
104 D. H. Kim, M. G. Cho, S.-K. Seo and H. M. Lee, " Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM ", J. Electron. Mater., vol. 38, no. 1, pp. 39-45 (2009).
105 J. H. Ryu, D. H. Seo, D. H. Kim and H. M. Lee, " Molecular Dynamics Simulations of the Diffusion and Rotation of Pt Nanoclusters Supported on Graphite ", Phys. Chem. Chem. Phys., vol. 11, no. 3, pp. 503-507 (2009).
106 S.-K. Seo, S. K. Kang, D.-Y. Shih and H. M. Lee, " An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate ", J. Electron. Mater., vol. 38, no. 2, pp. 257-265 (2009).
107 M. G. Cho, S. K. Kang, S.-K. Seo, D.-Y. Shih and H. M. Lee, " Effects of Under Bump Metallization and Nickel Alloying Element on the Undercooling Behavior of Sn-Based, Pb-free Solders ", J. Mater. Res., vol. 24, no. 2, pp. 534-543 (2009).
108 S.-K. Seo, S. K. Kang, D.-Y. Shih and H. M. Lee, "The Evolution of Microstructure and Microhardness of Sn-Ag and Sn-Cu Solders during High Temperature Aging", Microelectron. Reliab., vol. 49, no. 3, pp. 288-295 (2009).
 109 J. H. Ryu, H. Y. Kim, D. H. Kim, S. K. Choi and H. M. Lee, "Segregation and Internal Structures in the Bimetallic Clusters: Density Functional Theory and Molecular Dynamics Simulation", J. Nanosci. Nanotechno., vol. 9, no. 4, pp. 2553-2557 (2009).
110 M. G. Cho, S.-K. Seo and H. M. Lee, "Wettability and Interfacial Reactions of Sn-based Pb-free Solders with Cu-xZn Alloy Under Bump Metallurgies", J. Alloy. Compd., vol. 474, no. 1-2, pp. 510-516 (2009).
111 D. H. Seo, H. Y. Kim, J. H. Ryu and H. M. Lee, "Molecular Dynamics Simulation of the Diffusion of Au and Pt Nanoclusters on Carbon Nanotubes", J. Phys. Chem. C, vol. 113, no. 24, pp. 10416-10421 (2009).
112 D. H. Kim, H. Y. Kim, J. H. Ryu and H. M. Lee, "Phase Diagram of Ag-Pd Bimetallic Nanoclusters by Molecular Dynamics Simulations: Solid-to-Liquid Transition and Size-Dependent Behavior", Phys. Chem. Chem. Phys., vol. 11, no. 25, pp. 5079-5085 (2009).
113 M. G. Cho, H. Y. Kim, S.-K. Seo and H. M. Lee, "Enhancement of Heterogeneous Nucleation of β-Sn Phases in Sn-rich Solders by Adding Minor Alloying Elements with Hexagonal Closed Packed Structures, Appl. Phys. Lett., vol. 95, no. 2, pp. 021905/1-021905/3 (2009).
114 M. G. Cho, S.-K. Seo and H. M. Lee, "Undercooling, Microstructures and Hardness of Sn-rich Pb-free Solders on Cu-xZn Alloy Under Bump Metallurgies", Mater. Trans., vol. 50, no. 9, pp. 2291-2296 (2009).
115 H. Y. Kim, D. H. Kim, J. H. Ryu and H. M. Lee, "Design of Robust and Reactive Nanoparticles with Atomic Precision: 13Ag-Ih and 12Ag-1X (X = Pd, Pt, Au, Ni, or Cu) Core-Shell Nanoparticles", J. Phys. Chem. C, vol. 113, no. 35, pp. 15559-15564 (2009).
116 H. Y. Kim, H. M. Lee, R. G. S. Pala and H. Metiu, "Oxidative Dehydrogenation of Methanol to Formaldehyde by Isolated Vanadium, Molybdenum, and Chromium Oxide Clusters Supported on Rutile TiO2(110)", J. Phys. Chem. C, vol. 113, no. 36, pp. 16083-16093 (2009).
117 M. G. Cho, S. K. Kang, S.-K. Seo, D.-Y. Shih and H. M. Lee, "Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM during Thermal Aging", J. Electron. Mater., vol. 38, no. 11, pp. 2242-2250 (2009).
118 I. Jung, M. G. Cho and H. M. Lee, "Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-bearing Pb-free Solders on a Copper Substrate", J. Electron. Mater., vol. 38, no. 11, pp. 2301-2307 (2009).
119 S.-K. Seo, S. K. Kang, M. G. Cho, D.-Y. Shih and H. M. Lee, "The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by their Interfacial Reactions with Cu and Ni(P) Under Bump Metallugy", J. Electron. Mater., vol. 38, no. 12, pp. 2461-2469 (2009).
120 J. H. Ryu, H. Y. Kim, D. H. Kim, D. H. Seo and H. M. Lee, "Immobilization of Au Nanoclusters Supported on Graphite: Molecular Dynamics Simulations", J. Phys. Chem. C, vol. 114, no. 5, pp. 2022-2026 (2010).
121 H. Y. Kim, S. S. Han, J. H. Ryu and H. M. Lee, "Balance in Adsorption Energy of Reactants Steers CO Oxidation Mechanism of Ag13 and Ag12Pd1 Nanoparticles: Association Mechanism versus Carbonate Mediated Mechanism", J. Phys. Chem. C, vol. 114, no. 7, pp. 3156-3160 (2010).
122 Y. Yoo, K. Seo, S. Han, K. S. K. Varadwaj, H. Y. Kim, J. H. Ryu, H. M. Lee, J. P. Ahn, H. Ihee and B. Kim, "Steering Epitaxial Alignment of Au, Pd and AuPd Nanowire Arrays by Atom Flux Change", Nano. Lett., vol. 10, no. 2, pp. 432-438 (2010).
123 H. Y. Kim, H. M. Lee and J.-N. Park, "Bi-Functional Mechanism of CO2 Methanation on Pd-MgO/SiO2 Catalyst: Independent Roles of MgO and Pd on CO2 Methanation", J. Phys. Chem. C, vol. 114, no. 15, pp. 7128-7131 (2010).
124 S.-K. Seo, S. K. Kang, M. G. Cho and H. M. Lee, "Electromigration Performance of Pb-free Solder Joints in terms of Solder Composition and Joining Path to Cu or Ni(P) UBM", JOM, vol. 62, no. 7, pp. 22-29 (2010).
125 H. Y. Kim, H. M. Lee and H. Metiu, "Oxidative Dehydrogenation of Methanol to Formaldehyde by a Vanadium Oxide Cluster Supported on Rutile TiO2(110): Which Oxygen is Involved?", J. Phys. Chem. C, vol. 114, no. 32, pp. 13736-13738 (2010).
126 S.-K. Seo, M. G. Cho and H. M. Lee, "Crystal Orientations of β-Sn in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu Joints", J. Mater. Res., vol. 25, no. 10, pp. 1950-1957 (2010).
127 J. Chang, S.-K. Seo and H. M. Lee, "Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200oC, 500oC and 800oC", J. Electron. Mater., vol. 39, no. 12, pp. 2643-2652 (2010).
   2011-
128 Y. H. Jo, J. C. Park, J. U. Bang, H. Song and H. M. Lee, "New Synthesis Approach for Low Temperature Bimetallic Nanoparticles: Size and Composition Controlled Sn-Cu Nanoparticles", J. Nanosci. Nanotechno., vol. 11, no. 2, pp. 1037-1041 (2011).
129 H. Y. Kim, D. H. Kim and H. M. Lee, "Temperature and Composition Dependent Structural Evolution of AgPd Bimetallic Nanoparticle: Phase Diagram of (AgPd)151 Nanoparticle", J. Nanosci. Nanotechno. vol. 11, no. 3, pp. 2251-2255 (2011).
130 Y. H. Jo, I. Jung, C. S. Choi, I. Kim and H. M. Lee, "Synthesis and Characterization of Low Temperature Sn Nanoparticles for the Fabrication of Highly Conductive Ink", Nanotechnology, vol. 22, no. 22, pp. 225701/1-225701/8 (2011).
131 B.-G. Moon, K.-H. Kim and H. M. Lee, "Effect of Strontium Addition on the Microstructures and Mechanical Properties of Mg-5Al-3Ca Alloys", Mater. Trans., vol. 52, no. 6, pp. 1181-1185 (2011).
132 J. M. Yuk, K. Kim, B. Aleman, W. Regan, J. H. Ryu, J. Park, P. Ercius, H. M. Lee, A. P. Alivisatos, M. F. Crommie, J. Y. Lee and A. Zettl, "Graphene Veils and Sandwiches", Nano Lett., vol. 11, no. 8, pp. 3290-3294 (2011).
133 J. H. Ryu, S. S. Han, D. H. Kim, G. Henkelman and H. M. Lee, "Ligand Induced Structural Evolution of Pt55 Nanoparticles: Amine versus Thiol", ACS Nano, vol. 5, no. 11, pp. 8515-8522 (2011).
134 D. H. Kim, K. Shin and H. M. Lee, "CO Oxidation on Positively and Negatively Charged Ag13 Nanoparticles", J. Phys. Chem. C, vol. 115, no. 50, pp. 24771-24777 (2011).
135 M. G. Cho, Y. S. Park, S.-K. Seo, K. W. Paik and H. M. Lee, "Effect of Ag Addition on the Ripening Growth of Cu6Sn5 Grains at the Interface of Sn-xAg-0.5Cu/Cu during a Reflow", IEEE T. Components, Packaging and Manufacturing Technology, vol. 1, no. 12, pp. 1939-1946 (2011).
136 I. Jung, Y. H. Jo, I. Kim and H. M. Lee, "A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics", J. Electron. Mater., vol. 41, no. 1, pp. 115-121 (2012).
137 C. S. Choi, Y. H. Jo, M. G. Kim and H. M. Lee, "Control of Chemical Kinetics for Sub-10 nm Cu Nanoparticles to Fabricate Highly Conductive Ink below 150C", Nanotechnology, vol. 23, no. 6, pp. 065601/1-065601/8 (2012).
138 H. S. Jang, H. Y. Kim, Y.-S. Kim, H. M. Lee and D. Y Jeon, "Yellow-Emitting γ-Ca2SiO4:Ce3+,Li+ Phosphor for Solid State Lighting: Luminescent Properties, Electronic Structure, and White Light-Emitting Diode Application", Opt. Express, vol. 20, no. 2, pp. 2761-2771 (2012).
139 H. Y. Kim, H. M. Lee and G. Henkelman, "CO Oxidation Mechanism on CeO2-Supported Au Nanoparticles", J. Am. Chem. Soc. vol. 134, no. 3, pp. 1560-1570 (2012).
140 S. C. Yeo, D. H. Kim, K. Shin and H. M. Lee, "Phase Diagram and Structural Evolution of Ag-Au Bimetallic Nanoparticles: Molecular Dynamics Simulations", Phys. Chem. Chem. Phys., vol. 14, no. 8, pp. 2791-2796 (2012).
141 Y. H. Jo, I. Jung, N. R. Kim and H. M. Lee, "Synthesis and Characterization of Highly Conductive Sn-Ag Bimetallic Nanoparticles for Printed Electronics", J. Nanopart. Res., vol. 14, no. 4, pp. 782/1-782/10 (2012).
142 K. Shin, D. H. Kim, S. C. Yeo and H. M. Lee, "Structural Stability of AgCu Bimetallic Nanoparticles and their Application as a Catalyst: A DFT Study", Catal. Today, vol. 185, no. 1, pp. 94-98 (2012).
143 C. S. Choi, Y.-U. Park, H. Kim, N. R. Kim, K. Kang and H. M. Lee, "Three-Dimensional Sponge-like Architectured Cupric Oxides as High-Power and Long-Life Anode Material for Lithium Rechargeable Batteries", Electrochim. Acta, vol. 70, pp. 98-104 (2012).
144 J. Chang, S.-K. Seo, M. G. Cho, D. N. Lee, K.-S. Kang and H. M. Lee, "Effects of Be and Co Addition on the Growth of Sn Whiskers and the Properties of Sn-based Pb-free Solders", J. Mater. Res., vol. 27, no. 14, pp. 1877-1886 (2012).
145 I. Jung, K. Shin, N. R. Kim and H. M. Lee, "Synthesis of Low-Temperature-Processable and Highly Conductive Ag Ink by a Simple Ligand Modification: The Role of Adsorption Energy", J. Mater. Chem. C, vol. 1, no. 9, pp. 1855-1862 (2013).
146 S. C. Yeo, S. S. Han and H. M. Lee, "Adsorption, Dissociation, Penetration, and Diffusion of N2 on and in bcc Fe: First Principles Calculation", Phys. Chem. Chem. Phys., vol. 15, no. 14, pp. 5186-5192 (2013).
147 K. Shin, D. H. Kim and H. M. Lee, "Catalytic Characteristics of AgCu Bimetallic Nanoparticle in the Oxygen Reduction Reaction", ChemSusChem, vol. 6, no. 6, pp. 1044-1049 (2013).
148 N. R. Kim, I. Jung, Y. H. Jo and H. M. Lee, "A Simple Process for the Preparation of Copper (I) Oxide Nanoparticles by a Thermal Decomposition Process with Borane Tert-Butylamine Complex", J. Nanosci. Nanotechno., vol. 13. no. 9, pp. 6027-6032 (2013).
149 J. Chang, S. K. Kang, J.-H. Lee, K.-S. Kim and H. M. Lee, "Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions", J. Electron. Mater., vol.43, no.10, pp.259-269 (2014).
150 S. C. Yeo, S. S. Han and H. M. Lee, "Mechanistic Investigation of the Catalytic Decomposition of Ammonia (NH3) on an Fe(100) Surface: A DFT Study", J. Phys. Chem. C., vol. 118, no.10, pp.5309-5316 (2014).
151 J. Koo, J. Chang, Y. W. Lee, S. J. Hong, K.-S. Kim, H. M. Lee, "New Sn-0.7Cu Based Solder Alloys with Minor Alloying Additions of Pd, Cr and Ca", J. Alloy. Compd., vol.608, pp.126-132 (2014).
152 J. C. Park, S. C. Yeo, D. H. Chun, J. T. Lim, J.-I. Yang, H.-T. Lee, S. Hong, H. M. Lee, C. S. Kim and H. Jung, "Highly Activated K-Doped Iron Carbide Nanocatalysts Designed by Computational Simulation for Fischer-Tropsch Synthesis", J. Mater. Chem. A., vol.2 , pp.14371-14379 (2014).
153 C. Choi, S. C. Yeo, D. Kim, J. Kim, K. D. Yoo and H. M. Lee, "Study of Shallow Backside Junctions for Backside Illumination of CMOS Image Sensors", J. Electron. Mater., vol.43 , pp.3933-3941 (2014).
154 N. R. Kim, K. Shin, I. Jung, M. Shim and H. M. Lee, "Ag-Cu Bimetallic Nanoparticles with Enhanced Resistance to Oxidation: A Combined Experimental and Theoretical Study", J. Phys. Chem. C., vol.118 , pp.26324-26331 (2014).
155 S. C. Yeo, Y. C. Lo, J. Li, and H. M. Lee, "Theoretical study of the ammonia nitridation rate on an Fe (100) surface: A combined density functional theory and kinetic Monte Carlo study ", J. Chem. Phys., vol.141 , pp.134108/1-134108/8 (2014).
156 J. Chang, S. K. Kang, J.-H. Lee, K.-S. Kim and H. M. Lee, "Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films", J. Electron. Mater., vol.44 , pp.3486-3499 (2015).
157 J. Koo, C. Lee, S. J. Hong, K. -S. Kim and H. M. Lee, "Microstructural discovery of Al addition on Sn-0.5Cu-based Pb-free solder design", J. Alloy. Compd., vol.650 , pp.106-115 (2015).
158 C. Lee, N. R. Kim, J. Koo, Y. J. Lee and H. M. Lee, "Cu-Ag core-shell nanoparticles with enhanced oxidation stability for printed electronics", Nanotechnology, vol.26 , pp.455601-455609 (2015).
159 K. Bang, K. Shin, M. S. Ryu, S. Kwon and H. M. Lee, "Titanium-promoted Au-Ti bimetallic nanoparticle catalysts for CO oxidation: A theoretical approach", Catal. Today, vol.265 , pp.14-18 (2016).
160 J. Koo, S. Kwon, N. R. Kim, K. Shin and H. M. Lee, "Ethylenediamine-Enhanced Oxidation Resistivity of a Copper Surface during Water-Based Copper Nanowire Synthesis" J. Phys. Chem. C, vol.120 , pp.3334-3340 (2016).
161 H. An, S. Kwon, H. Y. Kim, and H. M. Lee, "Reactive Structural Motifs of Au Nanoclusters for Oxygen Activation and Subsequent CO Oxidation", J. Phys. Chem. C, vol.120, pp.9292-9298 (2016).
162 S. Kwon, K. Shin, K. Bang, H. Y. Kim, and H. M. Lee, "CO oxidation by MoS2-supported Au19 nanoparticles: effects of vacancy formation and tensile strain", Phys. Chem. Chem. Phys, vol.18 , pp.13232-13238 (2016).
163 D. -W. Choi, M. Yoo, H. M. Lee, J. Park, H. Y. Kim, and J. -S. Park, "A Study on the Growth Behavior and Stability of Molecular Layer Deposited Alucone Films using Diethylene Glycol and Trimethyl Aluminum Precursors, and the Enhancement of Diffusion Barrier Properties by Atomic Layer Deposited Al2O3 capping", ACS Appl. Mater. Interfaces, vol.8, pp.12263-12271 (2016).
164 C. -R. Chu, C. Lee, J. Koo, and H. M. Lee, "Fabrication of sintering-free flexible copper nanowire/polymer composite transparent electrodes with enhanced chemical and mechanical stability", Nano Research, vol.9 , pp.2162-2173 (2016).
165 N. R. Kim, Y. J. Lee, C. Lee, J. Koo, and H. M. Lee, "Surface modification of oleylamine-capped Ag-Cu nanoparticles to fabricate lowtemperature-sinterable Ag-Cu nanoink ", Nanotechnology, vol.27, pp.345706-345712 (2016).
166 Y. J. Lee, N. R. Kim, C Lee, and H. M. Lee, "Uniform thin film electrode made of low-temperaturesinterable silver nanoparticles: optimized extent of ligand exchange from oleylamine to acrylic acid", vol.19 (2017).
167 K. Shin, L. Zhang, H. An, H. Ha, M. Yoo, H. M. Lee, G. Henkelman, and H. Y. Kim, "Interface Engineering for a Rational Design of Poison-free Bimetallic CO Oxidation Catalysts", Nanoscale, vol.9, pp.5244-5253 (2017).
168 M. S. Ryu, H. G. Kim, H. Y. Kim, K. S. Min, H. J. Kim, and H. M. Lee, "Prediction of the glass transition temperature and design of phase diagrams of butadiene rubber and styrene-butadiene rubber via molecular dynamics simulations", vol.19, pp.16498-16506 (2017).
169 C. Lee, K. Shin, Y. J. Lee, C. Jun, and H. M. Lee, "Effects of Shell Thickness on Ag-Cu2O Core-Shell Nanoparticles with Bumpy Structures for Enhancing Photocatalytic Activity and Stability", Catalysis Today (2017).
170 C. Jung, C. Lee, K. Bang, J. Lim, H. J. Ryu, E. Cho, and H. M. Lee, "Synthesis of chemically ordered Pt3Fe/C intermetallic electrocatalysts for oxygen reduction reaction with enhaced activity and durability via a removable carbon coating" (2017).