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1 H. M. Lee and S. M. Allen, Homer Research Laboratories, Bethlehem Steel Bethlehem, Pennsylvania, USA, 1986.04.21
2 H. M. Lee and S. M. Allen, Carpenter Steel Division, Pennsylvania, USA, 1986.04.22
3 H. M. Lee and S. M. Allen, R & D Laboratories III, Nippon Steel Corporation, Kitakyushu, Japan, 1987.11.30
4 H. M. Lee and S. M. Allen, Ohita R & D Laboratory, Nippon Steel Corporation, Ohita, Japan, 1987.12.02
5 H. M. Lee, International Conference on High-Temperature Aluminides and Intermetallics (ASM), San Diego, CA, USA, 1991.09.16-19
6 H. M. Lee, Materials Science Division, Lawrence Berkeley Laboratory, Berkeley, California, USA, 1993.10.29
7 H. M. Lee, 123rd TMS Annual Meeting, San Francisco, CA, USA, 1994.02.28-03.03
8 H. M. Lee, Department of Materials Science and Mineral Engineering, University of California, Berkeley, CA, USA, 1994.06.10
9 H. M. Lee, 124th TMS Annual Meeting, Las Vegas, NV, USA, 1995.02.12-16
10 S. I. Park, S. Z. Han and H. M. Lee, 24th CALPHAD Meeting, Kyoto, Japan, 1995.05.21-26
11 B. J. Lee, J. R. Soh and H. M. Lee, The TMS Fall Meeting, Cleveland, Ohio, USA, 1995.10.29-11.02
12 S. W. Yoon, J.-R. Soh and H. M. Lee, The TMS Fall Meeting, Cleveland, Ohio, USA, 1995.10.29-11.02
13 H. M. Lee, Department of Materials Science, Tohoku University, Sendai, Japan, 1996.01.11
14 S. I. Park, S. Z. Han and H. M. Lee, 25th CALPHAD Meeting, Erice, Italy, 1996.05.26-31
15 J.-R. Soh and H. M. Lee, 25th CALPHAD Meeting, Erice, Italy, 1996.05.26-31
16 H. M. Lee, International Symposium on 50 Years of Metallurgy, New Delhi, India, 1996.11.14-17
17 B.-J. Lee, N.-M. Hwang and H. M. Lee, 26th CALPHAD Meeting, Palm Coast, Florida, USA, 1997.05.11-16
18 H. M. Lee, Max-Planck Institute fur Eisenforschung, Duesseldorf, Germany, 1997.08.20
19 H. M. Lee, 127th TMS Annual Meeting, San Antonio, TX, USA, 1998.02.15-19
20 Y. K. Kim and H. M. Lee, 27th CALPHAD Meeting, Beijing, China, 1998.05.17-22
21 W. K. Choi, S. W. Yoon and H. M. Lee, Fourth IUMRS International Conference on Electronic Materials (IUMRS-ICA-98), Cheju, Korea, 1998.08.24-17
22 H. M. Lee, 128th TMS Annual Meeting, San Diego, CA, USA, 1999.02.28-03.04
23 W. K. Choi and H. M. Lee, 128th TMS Annual Meeting, San Diego, CA, USA, 1999.02.28-03.04
24 J. S. Bae and H. M. Lee, 28th CALPHAD Meeting, Grenoble, France, 1999.05.02-07
25 W. K. Choi and H. M. Lee, 129th TMS Annual Meeting, Nashville, TN, USA, 2000.03.13-16
26 H. M. Lee, 29th CALPHAD Meeting, Boston, USA, 2000.06.18-23
27 W. K. Choi, J. H. Kim and H. M. Lee, User Aspects of Phase Diagrams organized by JCPC and APDIC, Sendai, Japan, 2000.09.19-21
28 W. K. Choi, H. M. Lee, J. H. Kim and S. W. Jeong, 130th TMS Annual Meeting, New Orleans, USA, 2001.02.11-15
29 W. K. Choi and H. M. Lee, CEPM-IBM Joint Meeting, Yorktown Heights, USA, 2001.02.16
30 J. H. Kim and H. M. Lee, 30th CALPHAD Meeting, York, England, UK, 2001.05.27-06.01
31 W. K. Choi and H. M. Lee, 1st Korea-Japan Berkeley Symposium on Advanced Materials, Seoul, Korea, 2001.07.04-06
32 H. M. Lee, Exhibition of Semiconductor EXPO’ 2001 in conjunction with 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar, Seoul, Korea, 2001.09.13
33 S. W. Yoon, J. H. Kim, C. J. Yang and H. M. Lee, 131st TMS Annual Meeting, Seattle, WA ,USA ,2002.02.17-21
34 W. K. Choi, H. M. Lee and S. W. Jeong, 131st TMS Annual Meeting, Seattle, WA, USA, 2002.02.17-21
35 S. S. Han and H. M. Lee, 31st CALPHAD Meeting, Stockholm, Sweden, 2002.05.05-11
36 H. M. Lee, Institute of Metallurgy and Materials Science, Krakow, Poland, 2002.08.26
37 H. M. Lee, Institute of Metallurgy and Materials Science, Krakow, Poland ,2002.08.27
38 H. M. Lee, CEPM-IZM Symposium on Electronic Packaging, Seoul, Korea, 2002.09.12-13
39 S. S. Han and H. M. Lee, The 2002 Korea-US Symposium on Phase Transformations of Nano-Materials, Seoul, Korea, 2002.10.25-26
40 H. M. Lee, The 2nd Tohoku University-KAIST/K-JIST Workshop on Materials Technology, Taejon, Korea, 2002.12.02
41 H. M. Lee, Tsinghua-SAIT-KAIST Symposium on Nano-Science, Taejon, Korea, 2003.02.17
42 H. M. Lee, Vietnam-Korea Symposium on Frontier Materials Science and Technology, Hanoi, Vietnam, 2003.02.25-26
43 J. H. Kim, S. W. Jeong and H. M. Lee, 132nd TMS Annual Meeting, San Diego, CA, USA, 2003.03.02-06
44 S. S. Han and H. M. Lee, 32nd CALPHAD Meeting, Quebec, Canada, 2003.05.26-30
45 H. K. Kim and H. M. Lee, 32nd CALPHAD Meeting, Quebec, Canada, 2003.05.26-30
46 S. S. Han and H. M. Lee, International Conference on the Science and Application of Nanotubes (NanoTechnology’03), Seoul, Korea, 2003.07.07-10
47 H. M. Lee, THERMEC’2003, Madrid, Spain, 2003.07.07-11
48 S. W. Jeong, J. H. Kim and H. M. Lee, 58th Annual ABM Congress International, Rio de Janeiro, Brazil, 2003.07.21-24
49 S. S. Han and H. M. Lee, KAIST-Kyoto University Joint Symposium on Materials Science and Engineering for the 21st Century, Taejon, Korea, 2003.08.20-22
50 H. K. Kim and H. M. Lee, The 2003 Korea-Japan Symposium on Current Issues on Phase Transformations, Busan, Korea, 2003.11.21-22
51 J. H. Yu, T. Kato, M. Oogane, T. Daibou, H. Kubota, Y. Ando, T. Miyazaki, and H. M. Lee, International Symposium on Magnetic Materials and Applications (SOMMA) and Winter Conference of the Korean Magnetic Society, Taejon, Korea, 2003.12.03-06
52 S. W. Jeong, J. H. Kim and H. M. Lee, Effect of Cooling Rate on IMC and Mechanical Properties of Sn-Ag-Cu/Cu Pad, 133rd TMS Annual Meeting, Charlotte, NC, USA, 2004.03.14-18
53 J. W. Nah, J. H. Kim, K. W. Paik and H. M. Lee, Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure, 133rd TMS Annual Meeting, Charlotte, NC, USA, 2004.03.14-18
54 J. H. Kim and H. M. Lee, Application of multicomponent phase diagrams in understandting phase evolution of solders/UBM system, 33rd CALPHAD Meeting, Krakow, Poland, 2004.05.30-06.04
55 H. K. Kim and H. M. Lee, KAIST-Kyoto University Joint Symposium on Materials Science and Engineering for the 21st Century, Kyoto, Japan, 2004.08.18-20
56 S. W. Jeong, J. H. Kim, M. G. Cho and H. M. Lee, 66th World Foundry Congress, Istanbul, Turkey, 2004.09.06-09
57 H. M. Lee, The 3rd International Symposium on Microelectronics and Packaging, Seoul, Korea, 2004.09.02-03
58 S. S. Han, W. A. Goddard, III and H. M. Lee, The 2nd International Symposium on Nanomanufacturing, Taejon, Korea, 2004.11.03-05
59 E. S. Noh and H. M. Lee, The 5th Pacific Rim International Conference on Advanced Materials and Processing, Beijing, China, 2004.11.03-05
60 M. G. Cho, K. W. Paik and H. M. Lee,, Interfacial Reaction Between 42Sn/58Si solder and Electroless Ni-p/Immersion Au UBM During Theraml Aging, 134th TMS Annual Meeting, San Francisco, CA, USA, 2005.02.13-17
61 J. W. Lee, S. K. Kang, D.-Y. Shih and H. M. Lee, High Temperature Hardness of Lead Free solder, 134th TMS Annual Meeting, San Francisco, CA, USA, 2005.02.13-17
62 S. S. Han, J. K. Kang, H. S. Kim, J. Y. Lee, A. C. T. van Duin, W. A. Goddard III and H. M. Lee, Symposium on Microstructures of Advanced Materials, Annual Spring Meeting of the Korean Ceramic Society, Seoul, Korea, 2005.04.22-23
63 J. Kloch, E. Guzik, J. Janczak-Rusch, D. Kopycinski, T. Rutti, J. H. Kim, H. M. Lee and W. Wolczynski, Morphology and Solute Redistribution at the Contact Substrate/Multi-Layer, 8th European Congress on Stereology and Image Analysis and 7th International Conference on Stereology and Image Analysis in Materials Science (STERMAT), Zakopane, Poland, 2005.05.10-13
64 S. S. Han, J. K. Kang, H. S. Kim, J. Y. Lee, A. C. T. van Duin, W. A. Goddard III and H. M. Lee, Effect of Mn and Cr addition on crystallization sequence and phase formation in A356 alloy; comparison between, 34th CALPHAD Meeting, Maastricht, Netherlands, 2005.05.22-27
65 H. Y. Kim, S. W. Han and H. M. Lee, Hydrogen absortion and desorption in carbon nanotubes, 34th CALPHAD Meeting, Maastricht, Netherlands, 2005.05.22-27
66 J. W. Lee and H. M. Lee, 3rd International Conference on Materials for Advanced Technologies (ICMAT2005) and 9th International Conference on Advanced Materials (ICAM2005), Singapore, 2005.07.03-08
67 H. M. Lee, Adsorption of Hydrogen on Carbon Nanotubes and Boron Nitride Nanotubes, 4th 21st Century COE International Symposium on Towards Creating New Industries Based on Inter-Nanoscience, Mie, Japan, 2005.11.18-19
68 H. M. Lee, HKUST-KAIST Joint Workshop on Electronic Packaging and Advanced Materials, Hong Kong, 2006.01.12-13
69 C. J. Yang, M. G. Cho and H. M. Lee, Intefacial Reactions in the Joint of 80Au-20Sn/58Bi-42Sn Combination Solder, 135th TMS Annual Meeting, San Antonio, San Antonio, TX, USA, 2006.03.12-16
70 S. K. Seo, W. K. Choi and H. M. Lee, Comparition of Sn-2.8Ag-20In and Sn-10Bi-10In Solders for Intermedate Step Soldering, 135th TMS Annual Meeting, San Antonio, San Antonio, TX, USA, 2006.03.12-16
71 H. M. Lee, Tsinghua University, Beijing, China, 2006.06.21
72 H. M. Lee, Shanghai Jiao Tong University, Shanghai, China, 2006.06.22
73 S. H. Lee, S. S. Han, J. K. Kang and H. M. Lee, Molecular Dynamics simulation on formation of icosahedron and coalescence of Pt nanoclusters, THERMEC’2006, Vancouver, Canada, 2006.07.04-08
74 S. W. Han and H. M. Lee, Substructures and Fatigue Crack Growth in HIPing and Semi-Liquid Die Casting A356 Alloys, THERMEC’2006, Vancouver, Canada, 2006.07.04-08
75 E. S. Noh, S. E. Ulloa and H. M. Lee, International Conference on Magnetism (ICM), Kyoto, Japan, 2006.08.20-25
76 E. S. Noh, S. E. Ulloa and H. M. Lee, IUMRS-International Conference in Asia (IUMRS-ICA-2006), Jeju, Korea, 2006.09.10-14
77 H. M. Lee, IIT-Bombay, Mumbai, India, 2006.12.19
78 H. M. Lee, IISc, Bangalore, India, 2006.12.21
79 Y.-H. Jo, J. W. Lee, S.-K. Seo, H. M. Lee, H. Han and D. C. Lee, Demonstration and Characterization of Sn3.0Ag5.0Cu/Sn57Bi1Ag Combination Solder, 136th TMS Annual Meeting, Orlando, FL, USA, 2007.02.25-03.01
80 M. G. Cho, H. M. Lee, S. K. Kang and D.-Y. Shih, Effects of the Minor Addition of Zn on Interfactial Reactions of Sn-Ag- Cu and Sn-Cu Solders On Various Cu Substrates during Thermal Aging, 136th TMS Annual Meeting, Orlando, FL, USA, 2007.02.25-03.01
81 S.-K. Seo, M. G. Cho and H. M. Lee, Thermodynamic assessment of the Bi-Ni system and Phase Equilibria of the Sn-Bi-Ni System, 136th TMS Annual Meeting, Orlando, FL, USA, 2007.02.25-03.01
82 H. G. Kim, H. Y. Kim and H. M. Lee, phase stability of the Bimettalic Nanocluster: Genetic Algorhizm, Basin-Hopping Monter Carlo and Molecular Dynamics sturdy, 36th CALPHAD Meeting, The Pennsylvania State University, State College, PA, USA, 2007.05.06-11
83 J. H. Ryu, H. Y. Kim, H. G. Kim, D. H. Kim and H. M. Lee, surface segregation in the Bimetallic Cluster Effect of Relative Cohesive Energy: Surface Energy and Atomic Radious, 36th CALPHAD Meeting, The Pennsylvania State University, State College, PA, USA, 2007.05.06-11
84 H. M. Lee, Xiangtan University-HKUST-KAIST Joint International Symposium on Polymer Engineering and Materials, Changsha, China, 2007.05.21-22
85 E. S. Noh, S. E. Ulloa and H. M. Lee, The Effect of the Geometrical Shape and Size of the Cross Section on the Spin-Polarized Transport and the Giant Magnetoresistance, International Symposium on Advanced Magnetic Materials and Applications (ISAMMA), Jeju, Korea, 2007.05.26-06.01
86 H. G. Kim, H. Y. Kim, D. H. Kim, J. H. Ryu and H. M. Lee, New technicque of basin-hopping Monte-Carlo for finding global optimazation :structure of pure and bimettalic nanoclusters, The 4th Conference of the Asian Consortium on Computational Materials Science (ACCMS-4), Seoul, Korea, 2007.09.13-16
87 H. Y. Kim, J. H. Ryu and H. M. Lee, effect of temperature on the atomic distribution of Silver-Palladium bimetallic cluster, The 4th Conference of the Asian Consortium on Computational Materials Science (ACCMS-4), Seoul, Korea, 2007.09.13-16
88 J. H. Ryu, H. Y. Kim, H. G. Kim, D. H. Kim and H. M. Lee, Collision and surface segregation in the bimettalic nanocluster: density functional theory and molecular dynamics simulation, The 4th Conference of the Asian Consortium on Computational Materials Science (ACCMS-4), Seoul, Korea, 2007.09.13-16
89 D. H. Kim, H. Y. Kim, H. G. Kim, J. H. Ryu and H. M. Lee, Study on solid to transition region of the Ag-Pd bimettalic nanocluster at various cosmopositions through collision, The 4th Conference of the Asian Consortium on Computational Materials Science (ACCMS-4), Seoul, Korea, 2007.09.13-16
90 D. H. Kim, H. Y. Kim, H. G. Kim, J. H. Ryu and H. M. Lee, Study on solid to liquid transition region of the Ag-Pd bimetallic nanocluster through collision, Joint Symposium on Materials Science and Engineering for the 21st Century, TsingHua, Taiwan, 2007.10.21-24
91 M. G. Cho, S. K. Kang, D.-Y. Shih and H. M. Lee, Undercooling of Pb-Free Solders on Various UMBs, 137th TMS Annual Meeting, New Orleans, LA, USA, 2008.03.09-13
92 D. H. Kim, M. G. Cho and H. M. Lee, Effecf on Co Addition on Undercooling,Microstuctures and Mircohardness of Sn-3.5Ag Solder and Interfacial Reations with Ni-P UBM, 137th TMS Annual Meeting, New Orleans, LA, USA, 2008.03.09-13
93 S.-K. Seo, S. K. Kang, D.-Y. Shih and H. M. Lee, An investication of Microstructure and Mechanical Properties of Pb-Free Solders as a Function Alloy composition and Cooling Rate, 137th TMS Annual Meeting, New Orleans, LA, USA, 2008.03.09-13
94 H. M. Lee, Computational materials science, APDIC, Saariselka, Finland, 2008.06.14
95 M. G. Cho, S.-K. Seo and H. M. Lee, Is the Cu-xZn Alloy Under Bump Metallurgy an Alternative to the Cu Substrate: Its Thermodynamic Interpretation, 37th CALPHAD, Saariselka, Finland, 2008.06.15-20
96 D. H. Kim and H. M. Lee, Phase diagram of the Ag-Pd bimetallic nanocluster: Molecular Dynamic simulation, 37th CALPHAD, Saariselka, Finland, 2008.06.15-20
97 H. Y. Kim, R. G. S. Pala, V. Shapovalov, H. Metiu and H. M. Lee, Density functional study on CO oxidation of doped rutile tio2(110), The 14th International Congress on Catalysis (ICC-2008), Seoul, Korea, 2008.07.13-18
98 B. Kim, Y. Yoo, K. S. K. Varadwaj, K. Seo, S. Han, H. Y. Kim, J. H. Ryu, H. M. Lee and J. P. Ahn, Orientation selection in self-seeded epitaxial growth of gold nanowires by deposition flux control, 2008 MRS Fall Meeting, Boston, USA, 2008.12.01-05
99 H. Y. Kim, D. H. Kim and H. M. Lee, Phase Diagram of the Ag-Pd Bimetallic Nanocluster, 2009 TMS annual meeting (138th), San Francisco, CA, USA, 2009.03.15-18
100 S.-K. Seo, S. K. Kang, M. G. Cho, D.-Y. Shih and H. M. Lee, The Microstructure and Crystal Orientation of Sn-Ag and Sn-Cu solders Affected by their Interfacial Reactions with Cu and (Ni)p, 2009 TMS annual meeting (138th), San Francisco, CA, USA, 2009.03.15-18
101 M. G. Cho, S. K. Kang, D.-Y. Shih and H. M. Lee, Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn solder with Ni-PUBM during Thermal Aging, 2009 TMS annual meeting (138th), San Francisco, CA, USA, 2009.03.15-18
102 I. Jung, M. G. Cho and H. M. Lee, Wetting Properties and Interfacial Reaction of Cu5Zn8-Bearing Pb-Free Solder on the Cu substrate by Mecanical Alloying, 2009 TMS annual meeting (138th), San Francisco, CA, USA, 2009.03.15-18
103 D. H. Kim, H. Y. Kim, J. H. Ryu and H. M. Lee, Phase diagram of the Ag-Pd bimetallic nanoclusters: Practical guideline for nano-material designs, 38th CALPHAD, Prague, Czech, 2009.05.17-22
104 S.-K. Seo, M. G. Cho and H. M. Lee, Thermodynamic Analysis of the Microstructural Change in Sn-rich Solders affected by their Interfacial Reaction with Cu or Ni(P) UBM, 38th CALPHAD, Prague, Czech, 2009.05.17-22
105 D. H. Kim, H. Y. Kim and H. M. Lee, CO oxidation by positively/negatively charged 13Ag nanoclusters, 238th American Chemical Society (ACS) National Meeting & Exposition, Washington, DC, USA, 2009.08.16-20
106 H. Y. Kim, D. H. Kim, J. H. Ryu and H. M. Lee, CO oxidation by 13Ag and 12Ag-1X (X=Au, Pt, Pd) nanoparticles: Morphology and spin density, 238th American Chemical Society (ACS) National Meeting & Exposition, Washington, DC, USA, 2009.08.16-20
107 B. Kim, Y. Yoo, J. H. Seo, S. Han, H. Y Kim, S. W. Yoon, D. H. Kim, H. M. Lee and J. P. Ahn, Superelastic Perfect Crystal Au Nanowires, 2009 MRS fall meeting, Boston, MA, USA, 2009.11.30-12.04
108 D. H. Kim, H. Y. Kim and H.M.Lee, Computational study on the phase and structural stability of Ag-based nanoclusters and its catalytic applications, MRS-J 20th anniversary Symposium, Yokoham, Japan, 2009.12.06
109 S.-K. Seo, S. K. Kang, M. G. Cho and H. M. Lee, Microstructures and Crystal Orientation of β-Sn for Sn-Ag and Sn-Cu solder Joints under Electromigration, 2010 TMS annual meeting (139th), Seattle, USA, 2010.02.14-18
110 J.W. Chang, S.-K. Seo and H. M. Lee, Phase Equilibria in the Sn-Ni-Zn Ternary System, 2010 TMS annual meeting (139th), Seattle, USA, 2010.02.14-18
111 M. G. Cho, H. Y. Kim, S.-K. Seo and H. M. Lee, Enhancement of Heteroheneous Nucleation of β-Sn Phases in Sn-Rich Solders by Adding Minor Alloying Elements with Hexagonal Closed Packed Structures, 2010 TMS annual meeting (139th), Seattle, USA, 2010.02.14-18
112 J. H. Ryu, H. Y. Kim, D. H. Kim and H. M. Lee, Amine induced structural change of cubo-octahedral platinum nanocluster and its properties, 39th CALPHAD, jeju, Korea, 2010.05.23-28
113 J.W. Chang, S.-K. Seo and H. M. Lee, Experimental Investigation of Phase Equilibria in the Sn-Ni-Zn System, 39th CALPHAD, jeju, Korea, 2010.05.23-28
114 M.G.Cho, Y.S.Park, S.-K.Seo, K.-W.Paik and H.M.Lee, Effect of Ag on Ripening Growth of Cu6Sn5 Grains Formed between Molten Sn-xAg-0.5Cu Solders and Cu, Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2010.06.01-04
115 S. C. Yeo, J. H. Ryu, K. H. Shin, D. H. Kim, H. Y. Kim, Y. H. Jo and H.M. Lee, Nano phase diagram study of Ag-Au bimetallic nanoparticles by Simulated Annealing method : MD simulation, 2010 Joint Symposium on the MSE for the 21st Century, Daejeon, Korea, 2010.06.27-29
116 I. Jung, Y. H. Jo and H. M. Lee, Synthesis of Ag nanoparticles for Applications in Printed Electronics, 2010 Joint Symposium on the MSE for the 21st Century, Daejeon, Korea, 2010.06.27-29
117 J.W. Chang, S.-K. Seo and H. M. Lee, Experimental Investigation of Phase Equilibria in the Sn-Ni-Zn System, 2010 Joint Symposium on the MSE for the 21st Century, Daejeon, Korea, 2010.06.27-29
118 Y. H. Jo, I. Jung and H. M. Lee, Synthesis Approach for low temperature Ag and Sn nanoparticles for applications in printed Electronics KAIST international workshop o flexible signage & displays, 2010 International Workshop on Flexible Signage and Displays, Daejeon, Korea, 2010.07.01
119 H.M.Lee, Interconnection Material Design: Past, Present and Future of Solders, Korea Electronics Technology Institute (KETI), Bundang, Korea, 2010.09.03
120 J.Lee, H.Lee and J.Lee, Electrochemical Etching of p-si for the Double Layer Porous Silicon Fabrication, 218th ECS Meeting, Las Vegas, NV, USA, 2010.10.10-15
121 H.M.Lee, Use of Phase Equilibria in Material Issues of Solder Interconnection in Electronic Packaging, Computational Thermodynamics and Kinetics: Seminar and Workshop, Seoul, Korea, 2010.12.07
122 M. G. Cho, S.-K. Seo and H. M. Lee, "Effect of Ag on Growth Behavior of Cu6Sn5 Formed between Molten Sn-xAg-0.5Cu Solders and Cu UBMs", 2011 TMS annual meeting (140th), San Diego, CA, USA, 2011.02.27-03.03
123 I. Jung, Y. H. Jo and H. M. Lee, "Synthesis of Ag Nanoparticles for the Fabrication of Highly Conductive Ink", 2011 TMS annual meeting (140th), San Diego, CA, USA, 2011.02.27-03.03
124 H.M.Lee, KAIST Colloquium of the Daedeok Branch, Daejeon, Korea, 2011.04.28
125 K. Shin, D. H. Kim, S. C. Yeo, H. M. Lee, Structural stability of AgCu bimetallic nanoparticle and its application as a catalyst: DFT, The 13th Korea-Japan Symposium on catalysis, Jeju, Korea, 2011.05.23-25
126 Y. H. Jo, I. Jung and H. M. Lee, Synthesis of Size and Composition Controlled Sn_xCu Nanoparticles : Effect on the Phase Diagram and Application to Highly Conductive Ink, 40th CALPHAD, Rio de Janeiro, Brazil, 2011.05.22-27
127 S. -K. Seo, M. G. Cho, S. K. Kang, J. W. Jang and H. M. Lee, Minor Alloying Effects of Ni or Zn on Microstructure and Microhardness of Pb-free Solders, The 61th Electronic Components and Technology Conference, Lake Buena, FL, USA, 2011.05.31-06.03
128 S. C. Yeo, D. H .Kim, K. Shin, H. M. Lee, Phase transition region and structural change of Ag-Au bimetallic nanoparticles, 2011 Joint Symposium, Singapole, 2011.06.19-22
129 H.M.Lee, Computational Thermodynamics and Kinetics: Seminar and Workshop, Seoul, Korea, 2011.07.04-05
130 J. H. Ryu, S. S. Han, D. H. Kim, and H. M. Lee, Structural Evolution of Pt55 Nanoparticles by Ligands : Amine versus Thiol, IUMRS-International Conference in Asia, Taipei, Taiwan, 2011.09.19-22
131 Y. H. Jo, I. Jung and H. M. Lee, Synthesis and Characterization of Low Temperature Sn-Cu and Sn Nanoparticles for the Fabrication of Highly Conductive Ink, 2012 TMS annual meeting (141st), Orlando, FL, USA, 2012.03.11-15
132 D. H. Kim. H. Y. Kim, J. H. Ryu, and H. M. Lee, Computational Study on Nanoparticles in Catalysis, 2012 TMS annual meeting (141st), Orlando, FL, USA, 2012.03.11-15
133 K. Shin, D. H. Kim, S. C. Yeo and H. M. Lee, Catalytic Properties of AgCu Bimetallic Nanoparticles for PEMFC Cathode: DFT Study, 2012 TMS annual meeting (141st), Orlando, FL, USA, 2012.03.11-15
134 S. C. Yeo, D. H. Kim, K. Shin and H. M. Lee, Nano Phase Diagram , Structural Change and Catalytic Application of Ag-Au Bimetallic Nanoparticles, 2012 TMS annual meeting (141st), Orlando, FL, USA, 2012.03.11-15
135 S. C. Yeo, D. H. Kim, K. Shin and H. M. Lee, Investigation of Nano Phase Diagram and Structural Change of Ag-Au Bimetallic Nanoparticles and Its Applications, 41st CALPHAD, Berkeley, CA, USA, 2012.06.03-08
136 M.S. Ryu, K. Kang, D. H. Kim and H. M. Lee, First Principles Calculations on the Effect of Doping on the Structural Stability of Zirconia, 2012 Joint Symposium, Gwangju, Korea, 2012.06.24-27
137 J. Chang, S. Kang, J. Lee, K. -S. Kim, H. M. Lee, Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Aging Conditions, 2013 TMS annual meeting (142nd), San Antonio, TX, USA, 2013.03.03-07
138 M. S. Ryu, H. M. Lee, Enhancement of Catalytic Performance in the Pt Nanoparticle by Doping Zirconia Support with Y or Ce: A DFT Calculation, 2013 TMS annual meeting (142nd), San Antonio, TX, USA, 2013.03.03-07
139 N. R. Kim, C. S. Choi, Y. H. Jo, I. Jung and H. M. Lee, Synthesis, Characterization and Applications of Cu, Cu2O and CuO nanoparticles, 2013 TMS annual meeting (142nd), San Antonio, TX, USA, 2013.03.03-07
140 N. R. Kim, I. Jung, Y. H. Jo, H. M. Lee, Preparation of AgCu Alloy Nanoparticles Using Thermal Decomposition Process for the Printed Electronics, 2013 TMS annual meeting (142nd), San Antonio, TX, USA, 2013.03.03-07
141 J. Chang, S. Kang, J. Lee, K. -S. Kim, H. M. Lee, Effect of Plastic Deformation on Sn Whisker Growth in Electroplated Sn and Sn-Ag, 2013 TMS annual meeting (142nd), San Antonio, TX, USA, 2013.03.03-07
142 S. Kang, J. Chang, J. Lee, K. -S. Kim, and H. M. Lee, Plastic Deformation Effect on Sn Whisker Growth in Electroplated Sn and Sn-Ag Solders, 2013 ECTC (63rd), Las Vegas, NV, USA, 2013.05.28-31
143 K. Shin, D. H. Kim, and H. M. Lee, DFT Study on the Catalytic Characteristics of AgCu Bimetallic Nanoparticles in the Oxygen Reduction Reaction, 42nd CALPHAD, San Sebastian, Spain, 2013.05.26-31
144 K. Shin, D. H. Kim, and H. M. Lee, Catalytic properties of charged Cu nanocluster for CO2 conversion to methanol, 2013 Joint Symposium, Hsinchu, Taiwan, 2013.06.23-26
145 H. M. Lee, Computational Materials Science in Pb-free Solders and Nanoparticles, PRICM8 (8th Pacific Rim International Conference on Advanced Materials and Processing), Waikoloa, HI, USA, 2013.08.04-09
146 J. Chang, S. K. Kang, J.-H. Lee, K.-S. Kim and H. M. Lee, A Study of Sn Whisker Growth using Minor Alloying Addition, and Plastic Deformation, EMAP2013 (15th International Conference on Electronic Materials and Packaging), KINTEX, Kyonggi-Do, Korea, 2013.10.06-09
147 S. C. Yeo, and H. M. Lee, Study of Mechanism and Real Time Simulation of Ammonia (NH3) Nitridation with a DFT Calculation and a KMC Simulation, 2014 TMS annual meeting (143rd), San Diego, CA, 2014.02.16-20
148 Y. J. Lee, N. R .Kim, J. Koo, and H. M. Lee, Ag Decorated Al Nanoparticles as Novel Ink Materials for Printed Electonics Applications, 2014 TMS annual meeting (143rd), San Diego, CA, USA, 2014.02.16-20
149 K. Shin, D. H. Kim, and H. M. Lee, Charge Effects on the Cu Pyramidal Nanoparticle and It's Application as a CO2 Conversion Catalyst, 2014 TMS annual meeting (143rd), San Diego, CA, USA, 2014.02.16-20
150 J. Koo, N. R. Kim, Y. J. Lee, and H. M. Lee, Ultra-long and Noble Copper Nanowires Tailored by Various Structure Directing Agents in Solution Process, 2014 TMS annual meeting (143rd), San Diego, CA, USA, 2014.02.16-20
151 N. R. Kim, K. Shin, and H. M. Lee, Fabrication of Ag-Cu Alloy Nanoparticles with Oxidation Resistance: Experimental and Theoretical Approaches, 2013 Annual Meeting of Excellent Graduate Schools for "Materials Integration Center" and "Materials Science Center", Akiu, Sendai, Japan, 2014.03.10-11
152 N. R. Kim, K. Shin, and H. M. Lee, Fabrication of Ag-Cu Nanoparticles Based on the Nano-Phase Diagram and Anti-Oxidation Effects, CALPHAD 43th, Changsha, Hunan, China, 2014.06.01-06
153 J. Koo, N. R. Kim, S. H. Kwon, Y. J. Lee, C. Lee, H. M. Lee, How to Grow Copper Nanowires in Water-Based Process?, Joint Symposium on Materials Science and Engineering for Next Generation, Sendai, Japan, 2014.06.23-25
154 S. H. Kwon, H. M. Lee, The Role of Structure Directing Agent on the Formation of Copper Nanowires: A DFT Study, 2015 TMS annual meeting (144th), Orlando, FL, USA, 2015.03.15-19
155 C. Lee, N. R. Kim, J. Koo, Y. J. Lee, H. M. Lee, Cu-Ag Core-Shell Nanoparticles as Conductive Ink Material for Printed Electronics Application, 2015 TMS annual meeting (144th), Orlando, FL, USA, 2015.03.15-19
156 H. M. Lee, Application of Nanotechnology to Pb-free Solders for Printed Electronics and Catalysis: Viewpoint of Computational Materials Science, World Congress and Expo on Nanotechnology and Materials Science, Dubai, UAE, 2015.04.13-15
157 K. Bang, K. Shin, M.S. Ryu, S. H. Kwon, H. M. Lee, Catalytic activity of the Au-Ti bimetallic nanoparticles on TiO2 support for CO oxidation: DFT study, The 15th Korea-Japan Symposium on catalysis, Busan, Korea, 2015.05.26-28
158 C. Lee, N. R. Kim, H. M. Lee, Anti-oxidation Property of Cu-Ag Core-Shell Nanoparticles Fabricated Using the Nano-Phase Diagram, 44th CALPHAD, Loano, Italy, 2015.05.31-06.05
159 K. Bang, K. Shin, M. S. Ryu, S. H. Kwon, H. M. Lee, DFT Study of Au-Ti Bimetallic Nanoparticle on TiO2 Support as Highly Active CO Oxidation Catalysts, 2016 TMS annual meeting (145th), Nashiville, TN, USA, 2016.02.14-18