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1 M. Grujicic, H. M. Lee and S. M. Allen, "Use of the THERMO-CALC Software and Database for Alloy Design of High-Strength Steels", in Proceedings of an International Conference on User Applications of Alloy Phase Diagrams ed. by L. Kaufman, ASM, Metals Park, OH, USA, pp. 195-201 (1987).
2 H. M. Lee, S. M. Allen and M. Grujicic, "Stability and Coarsening Resistance of M2C Carbides in Secondary Hardening Steels", in Proceedings of 34th Sagamore Army Materials Research Conference ed. by G. B. Olson, M. Azrin and E. S. Wright, U. S. Army Materials Technology Laboratory, Watertown, MA, USA, pp. 127-146 (1990).
3 S. Z. Han, J-R. Soh, H. M. Lee and Z.-H. Lee, "Coarsening Behavior of M2C Carbides in the Secondary Hardening Reaction", in Proceedings of First International Conference on Microstructures and Mechanical Properties of Aging Materials ed. by P. K. Liaw, K. L. Murty, W. B. Jones, R. Viswanathan and E. P. Simonen, TMS, Warrendale, PA, USA, pp. 509-518 (1993).
4 C. H. Yoo and H. M. Lee, "Study on the Tempering of Ultrahigh-Strength and High-Toughness AerMet100 Steel", in Proceedings of Second Pacific Rim International Conference on Advanced Materials and Processing ed. by K. S. Shin, J. K. Yoon and S. J. Kim, KIMM, Kyongju, Korea, pp. 2013-2018 (1995).
5 S. Z. Han, B. S. Rho and H. M. Lee, "Compositional Effect on Phase Stability and Hardness of Al66Mn9(Ti,Zr)25 Intermetallic Compounds", in Proceedings of Second Pacific Rim International Conference on Advanced Materials and Processing ed. by K. S. Shin, J. K. Yoon and S. J. Kim, KIMM, Kyongju, Korea, pp. 2477-2482 (1995).
6 S. Z. Han and H. M. Lee, "Analysis of Phase Structure of Al-Al3(Ti,V,Zr) Composite Alloy Prepared by Vacuum Arc Melting", in Proceedings of Second Pacific Rim International Conference on Advanced Materials and Processing ed. by K. S. Shin, J. K. Yoon and S. J. Kim, KIMM, Kyongju, Korea, pp. 2501-2506 (1995).
7 B. S. Rho, B.-J. Lee and H. M. Lee, "Phase Equilibria of the Low-Temperature Pb-Free Solder, Sn-In and Sn-In-Bi Systems", in Proceedings of the Third IUMRS International Conference in Asia (IUMRS-ICA-95) ed. by S. W. Kim and S. J. Park, MRS-K, Seoul, Korea, pp. 911-916 (1995).
8 S. I. Park, S. Z. Han and H. M. Lee, "Phase Stability of Al-Al3(Ti,V,Zr) Composite Systems", in Proceedings of the Third IUMRS International Conference in Asia (IUMRS-ICA-95) ed. by S. W. Kim and S. J. Park, MRS-K, Seoul, Korea, pp. 299-304 (1995).
9 S. W. Yoon, J.-R. Soh and H. M. Lee, "Thermodynamics-Aided Alloy Design of Sn-Bi-In-Zn Solder System", in Proceedings of the International Conference on Modelling and Simulation in Metallurgical Engineering and Materials Science ed. by Y. Zongsen, X. Zeqiang and X. Xishan, Metallurgical Industry Press, Beijing, China, pp. 160-165 (1996).
10 S. W. Yoon, J.-R. Soh, B.-J. Lee and H. M. Lee, "Alloy Design of Sn-Zn-X (X=In,Bi) Solder Systems through Phase Equilibria Calculations", in Proceedings of Design and Reliability of Solders and Solder Interconnects ed. by R. K. Mahidhara, D. R. Frear, S. M. L. Sastry, K. L. Murty, P. K. Liaw and W. L. Winterbottom, TMS, Warrendale, PA, USA, pp. 121-128 (1997).
11 B.-J. Lee and H. M. Lee, "Alloy Design of Sn-Ag-Bi-Sb Solder System Using Thermodynamic Calculations", in Proceedings of the Design and Reliability of Solders and Solder Interconnects ed. by R. K. Mahidhara, D. R. Frear, S. M. L. Sastry, K. L. Murty, P. K. Liaw and W. L. Winterbottom, TMS, Warrendale, PA, USA, pp. 129-136 (1997).
12 S. Z. Han, S. I. Park, S.-J. Kim and H. M. Lee, "Synthesis of Al66Mn9(Ti,Zr)25-Dispersion-Strengthened Al Alloys by Mechanical Alloying", in Proceedings of the Synthesis/Processing of Lightweight Metallic Materials II ed. by C. M. Ward-Close, F. H. Froes, S. S. Cho and D. J. Chellman, TMS, Warrendale, PA, USA, pp. 63-71 (1997).
13 S. Z. Han, S. I. Park and H. M. Lee, "Synthesis of Al3M and (AlM)3M Intermetallic Dispersion-Strengthened Al Alloys by Mechanical Alloying", in Proceedings of International Conference on Thermomechemical Processing of Steels & Other Materials ed. by T. Chandra, TMS, Wollongong, Australia, pp. 1003-1009 (1997).
14 W. K. Choi, S. W. Jeong and H. M. Lee, "The Effect of Cu Addition to Sn-3.5Ag Solder Joint", in Proceedings of The 4th Pacific Rim International Conference on Advanced Materials and Processing ed. by S. Hanada, Z. Zhong, S. W. Nam and R. N. Wright, JIM, Honolulu, HI, USA, pp. 1031-1034 (2001).
15 J. H. Kim and H. M. Lee, "The Alloy Design of the Pb-free High-temperature Solder System", in Proceedings of The 4th Pacific Rim International Conference on Advanced Materials and Processing ed. by S. Hanada, Z. Zhong, S. W. Nam and R. N. Wright, JIM, Honolulu, HI, USA, pp. 1079-1082 (2001).
16 S. W. Jeong and H. M. Lee, "Effect of Cooling Rate on the Microstructures and Mechanical Properties of Sn-Ag-Cu Lead-free Solder Joints on Cu Substrate", in Proceedings of the 65th World Foundry Congress ed. by C. P. Hong, D. H. Kim, K. Y. Kim and Y. J. Kim, KFS (The Korean Foundrymen’s Society), Kyongju, Korea, pp. 565-571 (2002).
17 S. W. Jeong, J. H. Kim and H. M. Lee, "Thermodynamic Alloy Design of Lead-free Solders and Thermodynamic Issues of Lead-free Soldering in Electronic Packaging", in Proceedings of the 58th Annual ABM Congress International ed. by R. R. de Avillez, ABM (The Brazilian Association of Metallurgy and Materials), Rio de Janeiro, Brazil, pp. 842-849 (2003).
18 S. W. Jeong, J. H. Kim and H. M. Lee, "Effect of Cooling Rates on IMC and Mechanical Properties of Sn-Ag-Cu / Cu Pad", in Proceedings of the 66th World Foundry Congress ed. by E. S. Kayali, M. C. Ensari and K. Dal, Istanbul, Turkey, pp. 91-102 (2004).
19 S. S. Han, W. A. Goddard, III and H. M. Lee, "Hydrogen Adsorption on Single-walled BN Nanotubes", in Proceedings of the 2nd International Symposium on Nanomanufacturing (ISNM) ed. by D. G. Gweon, K. H. Hwang and H. C. Lee, Taejon, Korea, pp. 81-86 (2004).
20 J. Kloch, E. Guzik, J. Janczak-Rusch, D. Kopycinski, T. Rutti, J. H. Kim, H. M. Lee and W. Wolczynski, "Morphology and Solute Redistribution at the Contact Substrate/Multi-Layer", in Proceedings of the 8th European Congress on Stereology and Image Analysis and 7th International Conference on Stereology and Image Analysis in Materials Science (STERMAT) ed. by J. Chraponski, J. Cwajna and L. Wojnar, Zakopane, Poland, pp. 375-382 (2005).
21 H. M. Lee, "Adsorption of Hydrogen on Carbon Nanotubes and Boron Nitride Nanotubes: Quantum and Atomistic Simulation", in Proceedings of the 4th 21st Century COE International Symposium on Towards Creating New Industries Based on Inter-Nanoscience ed. by the Institute of Scientific and Industrial Research, Osaka University, Mie, Japan, pp. 23-27 (2005).
22 S. W. Han and H. M. Lee, "Substructures and Fatigue Crack Growth in HIPing and Semi-Liquid Die Casting A356 Alloys", Mater. Sci. Forum, vol. 539-543, pp. 469-474 (2007).
23 S. H. Lee, S. S. Han, J. K. Kang and H. M. Lee, "Molecular Dynamics Simulation on Formation of Icosahedron and Coalescence of Pt Nanoclusters", Mater. Sci. Forum, vol. 539-543, pp. 3546-3550 (2007).
24 E. S. Noh, S. E. Ulloa and H. M. Lee, "The Effect of the Geometrical Shape and Size of the Cross Section on the Spin-Polarized Transport and the Giant Magnetoresistance : Finite Element Method Analysis", Solid State Phenomena, vol. 124-126, pp. 843-846 (2007).
25 H. W. Kim, S. H. Shim, H. J. Hwang, J. H. Shim, N. H. Cho, M. K. Park, H. M. Lee, B. T. Ahn, H. Jeon, J.-W. Park, J.-H. Ahn and B. Y. Hur, "SnO2 Nanostructures Synthesized on Co Substrates", Solid State Phenomena, vol. 124-126, pp. 1289-1292 (2007).
26 S. K. Kang, M. G. Cho, S.-K. Seo, D.-Y. Shih and H. M. Lee, "Controlling the Interfacial Reactions in Pb-free Interconnections by Adding Minor Alloying Elements to Sn-rich Solders", in Proceedings of the 58th Electronic Components & Technology Conference (ECTC), Lake Buena Vista, Florida, USA, pp.478-484 (2008).
27 W. K. Choi, D. Yu, C. Lee, L. Yan, A. Yu, S. W. Yoon, J. H. Lau, M. G. Cho, Y. H. Jo and H. M. Lee, "Development of Low Temperature Bonding Using In-Based Solders", in Proceedings of the 58th Electronic Components & Technology Conference (ECTC), Lake Buena Vista, Florida, USA, pp.1294-1299 (2008).
28 M. G. Cho, Y. S. Park, S.-K. Seo, K.-W. Paik and H. M. Lee, "Effect of Ag on Ripening Growth of Cu6Sn5 Grains Formed between Molten Sn-xAg-0.5Cu Solders and Cu" in Proceedings of the 60th Electronic Components and Technology Conference (ECTC2010), Las Vegas, NV, USA, pp. 170-175 (2010).
29 S.-K. Seo, M. G. Cho, S. K. Kang, J. W. Jang and H. M. Lee, "Minor Alloying Effects of Ni or Zn on Microstructure and Microhardness of Pb-free Solders", in Proceedings of the 61st Electronic Components and Technology Conference (ECTC2011), Lake Buena Vista, FL, USA, pp. 84-89 (2011).
30 S. K. Kang, J. Chang, J. Lee, K.-S. Kim and H. M. Lee, "Plastic Deformation Effect on Sn Whisker Growth in Electroplated Sn and Sn-Ag Solders", in Proceedings of the 63rd Electronic Components and Technology Conference (ECTC2013), Las Vegas, NV, USA, pp. 1018-1023 (2013).