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   1990~2010
127 J. Chang, S.-K. Seo and H. M. Lee,

"Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200oC, 500oC and 800oC"

Journal of Electronic Materials , vol. 39, no. 12, pp. 2643-2652 (2010).

126 S.-K. Seo, M. G. Cho and H. M. Lee,

"Crystal Orientations of 棺-Sn in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu Joints"

Journal of Materials Research , vol. 25, no. 10, pp. 1950-1957 (2010).

125 H. Y. Kim, H. M. Lee and H. Metiu,

"Oxidative Dehydrogenation of Methanol to Formaldehyde by a Vanadium Oxide Cluster Supported on Rutile TiO2(110): Which Oxygen is Involved?"

Journal of Physical Chemistry C , vol. 114, no. 32, pp. 13736-13738 (2010).

124 S.-K. Seo, S. K. Kang, M. G. Cho and H. M. Lee,

"Electromigration Performance of Pb-free Solder Joints in terms of Solder Composition and Joining Path to Cu or Ni(P) UBM"

JOM , vol. 62, no. 7, pp. 22-29 (2010).

123 H. Y. Kim, H. M. Lee and J.-N. Park,

"Bi-Functional Mechanism of CO2 Methanation on Pd-MgO/SiO2 Catalyst: Independent Roles of MgO and Pd on CO2 Methanation"

Journal of Physical Chemistry C , vol. 114, no. 15, pp. 7128-7131 (2010).

122 Y. Yoo, K. Seo, S. Han, K. S. K. Varadwaj, H. Y. Kim, J. H. Ryu, H. M. Lee, J. P. Ahn, H. Ihee and B. Kim,

"Steering Epitaxial Alignment of Au, Pd and AuPd Nanowire Arrays by Atom Flux Change"

Nano Letters , vol. 10, no. 2, pp. 432-438 (2010).

121 H. Y. Kim, S. S. Han, J. H. Ryu and H. M. Lee,

"Balance in Adsorption Energy of Reactants Steers CO Oxidation Mechanism of Ag13 and Ag12Pd1 Nanoparticles: Association Mechanism versus Carbonate Mediated Mechanism"

Journal of Physical Chemistry C , vol. 114, no. 7, pp. 3156-3160 (2010).

120 J. H. Ryu, H. Y. Kim, D. H. Kim, D. H. Seo and H. M. Lee,

"Immobilization of Au Nanoclusters Supported on Graphite: Molecular Dynamics Simulations"

Journal of Physical Chemistry C , vol. 114, no. 5, pp. 2022-2026 (2010).

119 S.-K. Seo, S. K. Kang, M. G. Cho, D.-Y. Shih and H. M. Lee,

"The Crystal Orientation of 棺-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by their Interfacial Reactions with Cu and Ni(P) Under Bump Metallugy"

Journal of Electronic Materials , vol. 38, no. 12, pp. 2461-2469 (2009).

118 I. Jung, M. G. Cho and H. M. Lee,

"Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-bearing Pb-free Solders on a Copper Substrate"

Journal of Electronic Materials , vol. 38, no. 11, pp. 2301-2307 (2009).

117 M. G. Cho, S. K. Kang, S.-K. Seo, D.-Y. Shih and H. M. Lee,

"Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM during Thermal Aging"

Journal of Electronic Materials , vol. 38, no. 11, pp. 2242-2250 (2009).

116 H. Y. Kim, H. M. Lee, R. G. S. Pala and H. Metiu,

"Oxidative Dehydrogenation of Methanol to Formaldehyde by Isolated Vanadium, Molybdenum, and Chromium Oxide Clusters Supported on Rutile TiO2(110)"

Journal of Physical Chemistry C , vol. 113, no. 36, pp. 16083-16093 (2009).

115 H. Y. Kim, D. H. Kim, J. H. Ryu and H. M. Lee,

"Design of Robust and Reactive Nanoparticles with Atomic Precision: 13Ag-Ih and 12Ag-1X (X = Pd, Pt, Au, Ni, or Cu) Core-Shell Nanoparticles"

Journal of Physical Chemistry C , vol. 113, no. 35, pp. 15559-15564 (2009).

114 M. G. Cho, S.-K. Seo and H. M. Lee,

"Undercooling, Microstructures and Hardness of Sn-rich Pb-free Solders on Cu-xZn Alloy Under Bump Metallurgies"

Materials Transactions , vol. 50, no. 9, pp. 2291-2296 (2009).

113 M. G. Cho, H. Y. Kim, S.-K. Seo and H. M. Lee,

"Enhancement of Heterogeneous Nucleation of 棺-Sn Phases in Sn-rich Solders by Adding Minor Alloying Elements with Hexagonal Closed Packed Structures"

Applied Physics Letters , vol. 95, no. 2, pp. 021905/1-021905/3 (2009).

112 D. H. Kim, H. Y. Kim, J. H. Ryu and H. M. Lee,

"Phase Diagram of Ag-Pd Bimetallic Nanoclusters by Molecular Dynamics Simulations: Solid-to-Liquid Transition and Size-Dependent Behavior"

Physical Chemistry Chemical Physics , vol. 11, no. 25, pp. 5079-5085 (2009).

111 D. H. Seo, H. Y. Kim, J. H. Ryu and H. M. Lee,

"Molecular Dynamics Simulation of the Diffusion of Au and Pt Nanoclusters on Carbon Nanotubes"

Journal of Physical Chemistry C , vol. 113, no. 24, pp. 10416-10421 (2009).

110 M. G. Cho, S.-K. Seo and H. M. Lee,

"Wettability and Interfacial Reactions of Sn-based Pb-free Solders with Cu-xZn Alloy Under Bump Metallurgies"

Journal of Alloys and Compounds , vol. 474, no. 1-2, pp. 510-516 (2009).

109 J. H. Ryu, H. Y. Kim, D. H. Kim, S. K. Choi and H. M. Lee,

"Segregation and Internal Structures in the Bimetallic Clusters: Density Functional Theory and Molecular Dynamics Simulation"

Journal of Nanoscience and Nanotechnology , vol. 9, no. 4, pp. 2553-2557 (2009).

108 S.-K. Seo, S. K. Kang, D.-Y. Shih and H. M. Lee,

"The Evolution of Microstructure and Microhardness of Sn-Ag and Sn-Cu Solders during High Temperature Aging"

Microelectronics Reliability , vol. 49, no. 3, pp. 288-295 (2009).

107 M. G. Cho, S. K. Kang, S.-K. Seo, D.-Y. Shih and H. M. Lee,

"Effects of Under Bump Metallization and Nickel Alloying Element on the Undercooling Behavior of Sn-Based, Pb-free Solders"

Journal of Materials Research , vol. 24, no. 2, pp. 534-543 (2009).

106 S.-K. Seo, S. K. Kang, D.-Y. Shih and H. M. Lee,

"An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate"

Journal of Electronic Materials , vol. 38, no. 2, pp. 257-265 (2009).

105 J. H. Ryu, D. H. Seo, D. H. Kim and H. M. Lee,

"Molecular Dynamics Simulations of the Diffusion and Rotation of Pt Nanoclusters Supported on Graphite"

Physical Chemistry Chemical Physics , vol. 11, no. 3, pp. 503-507 (2009).

104 D. H. Kim, M. G. Cho, S.-K. Seo and H. M. Lee,

"Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM"

Journal of Electronic Materials , vol. 38, no. 1, pp. 39-45 (2009).

103 H. Y. Kim, H. G. Kim, D. H. Kim and H. M. Lee,

"Overstabilization of the Metastable Structure of Isolated Ag-Pd?Bimetallic Clusters"

Journal of Physical Chemistry C , vol. 112, no. 44, pp. 17138-17142 (2008).

102 H. Y. Kim, H. M. Lee, R. G. S. Pala, V. Shapovalov and H. Metiu,

"CO Oxidation by Rutile TiO2(11) doped with V, W, Cr, Mo and Mn"

Journal of Physical Chemistry C , vol. 112, no. 32, pp. 12398-12408 (2008).

101 E. S. Noh, S.-C. Lee, S. E. Ulloa and H. M. Lee,

"A Theoretical Study of the Spin-Polarized Transport and the Giant Magnetoresistance: the Effect of the Number of Layers in a Magnetic Multilayer"

Journal of Applied Physics , vol. 103, no. 8, pp. 083903/1-083903/8 (2008).

100 H. G. Kim, S. K. Choi and H. M. Lee,

"New Algorithm in the Basin Hopping Monte Carlo to find the Global Minimum Structure of Unary and Binary Metallic Nanoclusters"

Journal of Chemical Physics , vol. 128, no. 14, pp. 144702/1-144702/4 (2008).

99 M. G. Cho, S. K. Kang and H. M. Lee,

"Undercooling and Microhardness of Pb-free Solders on Various UBMs"

Journal of Materials Research , vol. 23, no. 4, pp. 1147-1154 (2008).

98 S. H. Lee, S. S. Han, J. K. Kang, J. H. Ryu and H. M. Lee,

"Stability of Pt Nanoclusters and the Effect of (0001) Graphite Surface through Molecular Dynamics Simulation"

Surface Science , vol. 602, no. 7, pp. 1433-1439 (2008).

97 C. J. Yang, M. G. Cho and H. M. Lee,

"Synthesis of the Combination Solder of 80Au-20Sn/42Sn-58Bi and Thermodynamic Interpretation of the Microstructural Evolution"

Materials Transactions , vol. 49, no. 2, pp. 376-381 (2008).

96 Y.-H. Jo, J. W. Lee, S.-K. Seo, H. M. Lee, H. Han and D. C. Lee,

"Demonstration and Characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag Combination Solder for 3-D Multi-Stacking"

Journal of Electronic Materials , vol. 37, no. 1, pp. 110-117 (2008).

95 D. H. Kim, H. Y. Kim, H. G. Kim, J. H. Ryu, and H. M. Lee,

"The Solid to Liquid Transition Region of the Ag-Pd Bimetallic Nanocluster"

Journal of Physics: Condensed Matter , vol. 20, no. 3, pp. 035208/1-035208/5 (2008).

94 E. S. Noh, S. E. Ulloa and H. M. Lee,

"A Theoretical Study of an Amorphous Aluminium Oxide Layer used as a Tunnel Barrier in a Magnetic Tunnel Junction"

physica status solidi (b) , vol. 244, no. 12, pp. 4427-4430 (2007).

93 S.-K. Seo, M. G. Cho and H. M. Lee,

"Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System"

Journal of Electronic Materials , vol. 36, no. 11, pp. 1536-1544 (2007).

92 M. G. Cho, S. K. Kang, D.-Y. Shih and H. M. Lee,

"Effects of Minor Addition of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging"

Journal of Electronic Materials , vol. 36, no. 11, pp. 1501-1509 (2007).

91 H. Y. Kim, H. G. Kim, J. H. Ryu and H. M. Lee,

"Preferential Segregation of Pd Atoms in the Ag-Pd Bimetallic Cluster: Density Functional Theory and Molecular Dynamics Simulation"

Physical Review B , vol. 75, no. 21, pp. 212105/1-212105/4 (2007).

90 H. Y. Kim, S. H. Lee, H. G. Kim, J. H. Ryu and H. M. Lee,

"Molecular Dynamic Simulation of Coalescence between Ag and Pd Clusters"

Materials Transactions , vol. 48, no. 3, pp. 455-459 (2007).

89 E. S. Noh, S. E. Ulloa and H. M. Lee,

"Finite Element Method Study for the Spin-Polarized Transport in a Hybrid Spin Valve"

Journal of Magnetism and Magnetic Materials , vol. 310, no. 2, pp. 1889-1891 (2007).

88 S. K. Seo, M. G. Cho, H. M. Lee and W. K. Choi,

"Comparison of Sn2.8Ag20In and Sn10Bi10In Solders for Intermediate Step Soldering"

Journal of Electronic Materials , vol. 35, no. 11, pp. 1975-1981 (2006).

87 W. Wolczynski, E. Guzik, J. Janczak-Rusch, D. Kopycinski, J. Golczewski, H. M. Lee and J. Kloch,

"Morphological Characteristics of Multi-Layer/Substrate Systems"

Materials Characterization , vol. 56, no. 4-5, pp. 274-280 (2006).

86 H. Y. Kim, T. Y. Park, S. W. Han and H. M. Lee,

"Effects of Mn on the Crystal Structure of 慣-Al(Mn,Fe)Si Particles in A356 Alloys"

Journal of Crystal Growth , vol. 291, no. 1, pp. 207-211 (2006).

85 H. Y. Kim, S. W. Han and H. M. Lee,

"The Influence of Mn and Cr on the Tensile Properties of A356-0.20Fe Alloy"

Materials Letters , vol. 60, no. 15, pp. 1880-1883 (2006).

84 M. G. Cho, K. W. Paik, S. W. Booh, T.-G. Kim and H. M. Lee,

"Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion Au UBM during Thermal Aging"

Journal of Electronic Materials , vol. 35, no. 1, pp. 35-40 (2006).

83 S. S. Kim, J. H. Kim, S. W. Booh, T.-G. Kim and H. M. Lee,

"Microstructural Evolution of Joint Interface between Eutectic 80Au-20Sn Solder and Under Bump Metallurgy"

Materials Transactions , vol. 46, no. 11, pp. 2400-2405 (2005).

82 J.-W. Lee, Z.-H. Lee and H. M. Lee,

"Formation of Intermetallics in the Ni bearing Lead free and Composite Solders"

Materials Transactions , vol. 46, no. 11, pp. 2344-2350 (2005).

81 J. S. Shin, J. S. Bae, H. J. Kim, H. M. Lee, T. D. Lee, E. J. Lavernia and Z.-H. Lee,

"Ordering-Disordering Phenomena and Micro-Hardness Characteristics of B2 Phase in Fe-(5-6.5%)Si Alloys"

Materials Science and Engineering , vol. A407, pp. 282-290 (2005).

80 S. S. Han, H. S. Kim, K. S. Han, J. Y. Lee, H. M. Lee, J. K. Kang, S. I. Woo, A. C. T. van Duin and W. A. Goddard III,

"Nanopores of Carbon Nanotubes as Practical Hydrogen Storage Media"

Applied Physics Letters , vol. 87, no. 21, pp. 213113/1-213113/3 (2005).

79 S. S. Han, S. H. Lee, J. K. Kang and H. M. Lee,

"High Coverage of Hydrogen on a (10,0) Single-Walled Boron Nitride Nanotube"

Physical Review B , vol. 72, no. 11, pp. 113402/1-113402/4 (2005).

78 S. S. Han, J. K. Kang, H. M. Lee, A. C. T. van Duin and W. A. Goddard III,

"The Theoretical Study on Interaction of Hydrogen with Single-walled Boron Nitride Nanotubes: Part II. Collision, Storage, and Adsorption"

Journal of Chemical Physics , vol. 123, no. 11, pp. 114704/1-114704/7 (2005).

77 S. S. Han, J. K. Kang, H. M. Lee, A. C. T. van Duin and W. A. Goddard III,

"The Theoretical Study on Interaction of Hydrogen with Single-walled Boron Nitride Nanotubes: Part I. The Reactive Force Field ReaxFFHBN Development"

Journal of Chemical Physics , vol. 123, no. 11, pp. 114703/1-114703/8 (2005).

76 S. S. Han, A. C. T. van Duin, W. A. Goddard III and H. M. Lee,

"Optimization and Application of Lithium Parameters for the Reactive Force Field, ReaxFF"

The Journal of Physical Chemistry A , vol. 109, no. 20, pp. 4575-4582 (2005).

75 S. S. Han, J. K. Kang, A. C. T. van Duin, W. A. Goddard III and H. M. Lee,

"Liquefaction of H2 Molecules upon Exterior Surfaces of Carbon Nanotube Bundles"

Applied Physics Letters , vol. 86, no. 20, pp. 203108/1-203108/3 (2005).

74 H. G. Kim and H. M. Lee,

"Study of the Effect of Heat Treatment on a Pt-Co Thin Film by Monte Carlo Simulations coupled with a Modified Embedded Atom Method"

Zeitschrift fur Metallkunde , vol. 96, no. 2, pp. 211-215 (2005).

73 E. S. Noh and H. M. Lee,

"Exchange-Bias of NiFe/NiO Bilayer"

Materials Science Forum , vol. 475-479, pp. 2231-2234 (2005).

72 S. W. Jeong, J. H. Kim and H. M. Lee,

"Effect of Cooling Rate on Growth of IMC and Fracture Mode of Near-Eutectic Sn-Ag-Cu / Cu Pad: Before and After Aging"

Journal of Electronic Materials , vol. 33, no. 12, pp. 1530-1544 (2004).

71 S. S. Han and H. M. Lee,

"Adsorption Properties of Hydrogen on (10,0) Single-Walled Carbon Nanotube through Density Functional Theory"

Carbon , vol. 42, no. 11, pp. 2169-2177 (2004).

70 T. Y. Kim, S. S. Han and H. M. Lee,

"Nanomechanical Behavior of 棺-SiC Nanowire in Tension: Molecular Dynamic Simulations"

Materials Transactions , vol. 45, no. 5, pp. 1442-1449 (2004).

69 S. S. Han and H. M. Lee,

"Study on Cap Closure Mechanism of Single-Walled Carbon Nanotubes by Molecular Dynamics"

Materials Transactions , vol. 45, no. 5, pp. 1437-1441 (2004).

68 J. H. Kim, S. W. Jeong and H. M. Lee,

"Abnormal Grain Growth of Ni3Sn4 at Sn-3.5Ag/Ni Interface"

Materials Transactions , vol. 45, no. 3, pp. 710-713 (2004).

67 S. S. Han, K. S. Lee and H. M. Lee,

"Nucleation Mechanism of Carbon Nanotube"

Chemical Physics Letters , vol. 383, no. 3-4, pp. 321-325 (2004).

66 J. W. Nah, J. H. Kim, H. M. Lee and K. W. Paik,

"Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure"

Acta Materialia , vol. 52, no. 1, pp. 129-136 (2004).

65 J. H. Kim, S. W. Jeong, H. D. Kim and H. M. Lee,

"Morphological Transition of Interfacial Ni3Sn4 Grains at Sn-3.5Ag/Ni Joint"

Journal of Electronic Materials , vol. 32, no. 11, pp. 1228-1234 (2003).

64 S. W. Jeong, J. H. Kim and H. M. Lee,

"Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging"

Materials Science Forum , vol. 426-432, pp. 4081-4086 (2003).

63 J. H. Yu, H. M. Lee, Y. Ando and T. Miyazaki,

"Electron Transport Properties in Magnetic Tunnel Junctions with Epitaxial NiFe (111) Ferromagnetic Bottom Electrodes"

Applied Physics Letters , vol. 82, no. 26, pp. 4735-4737 (2003).

62 J. H. Yu, H. M. Lee, M. Hayashi, M. Oogane, T. Daibou, H. Nakamura, H. Kubota, Y. Ando and T. Miyazaki,

"Magnetic Tunnel Junctions with High Magnetoresistance and Small Bias Voltage Dependence using Epitaxial NiFe(111) Ferromagnetic Bottom Electrodes"

Journal of Applied Physics , vol. 93, no. 10, pp. 8555-8557 (2003).

61 J. K. Park, J. H. Kim, S. I. Park, H. M. Lee and D. Y. Oh,

"Evolution of Grain Structure of As-deposited Cr Thin Film with Deposition Temperature"

Scripta Materialia , vol. 48, no. 8, pp. 1161-1166 (2003).

60 S. W. Yoon, J. H. Kim, S. W. Jeong and H. M. Lee,

"Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy"

Materials Transactions , vol. 44, no. 2, pp. 290-297 (2003).

59 S. I. Park, S. S. Han, H. G. Kim, J. K. Park and H. M. Lee,

"Three-Dimensional Monte-Carlo Simulation of Grain Growth in Pt-Co Thin Film"

Journal of Electronic Materials , vol. 31, no. 10, pp. 965-971 (2002).

58 J. H. Kim, S. W. Jeong and H. M. Lee,

"Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications"

Materials Transactions , vol. 43, no. 8, pp. 1873-1878 (2002).

57 J. H. Kim, S. W. Jeong and H. M. Lee,

"A Thermodynamic Study of Phase Equilibria in the Au-Sb-Sn Solder System"

Journal of Electronic Materials , vol. 31, no. 6, pp. 557-563 (2002).

56 H. J. Kim, J. S. Bae, T. D. Lee and H. M. Lee,

"Effect of Sputtering Condition and Heat Treatment in Co/Cu/Co/FeMn Spin Valve"

Journal of Magnetism and Magnetic Materials , vol. 241, no. 2-3, pp. 173-178 (2002).

55 W. K. Choi, S.-Y. Jang, J. H. Kim, K.-W. Paik and H. M. Lee,

"Grain Morphology of Intermetallic Compounds at Solder Joints"

Journal of Materials Research , vol. 17, no. 3, pp. 597-599 (2002).

54 J. S. Bae, K. H. Shin and H. M. Lee,

"Microstructural Observation on Effect of Oxidation Method of AlOx in Magnetic Tunnel Junction by HRTEM"

Journal of Applied Physics , vol. 91, no. 10, pp. 7947-7949 (2002).

53 J. S. Bae, K. H. Shin, T. D. Lee and H. M. Lee,

"Study of the Effect of Natural Oxidation and Thermal Annealing on Microstructures of AlOx in the Magnetic Tunnel Junction by High-Resolution Transmission Electron Microscopy"

Applied Physics Letters , vol. 80, no. 7, pp. 1168-1170 (2002).

52 W. K. Choi, J. H. Kim, S. W. Jeong and H. M. Lee,

"Interfacial Microstructure and Joint Strength of Sn-3.5Ag-X (X=Cu, In and Ni) Solder Joint"

Journal of Materials Research , vol. 17, no. 1, pp. 43-51 (2002).

51 W. K. Choi and H. M. Lee,

"Prediction of Primary Intermetallic Compound Formation during Interfacial Reaction between Sn-based Solder and Ni Substrate"

Scripta Materialia , vol. 46, no. 11, pp. 777-781 (2002).

50 S. I. Park, B.-J. Lee and H. M. Lee,

"Estimation of Order-Disorder Transition Temperature in Pt-Co Alloy by Monte Carlo Simulation Using Modified Embedded Atom Method"

Scripta Materialia , vol. 45, no. 5, pp. 495-502 (2001).

49 W. K. Choi, S. W. Yoon and H. M. Lee,

"Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate"

Materials Transactions , vol. 42, no. 5, pp. 783-789 (2001).

48 J. H. Yu, J. S. Shin, J. S. Bae, Z.-H. Lee, T. D. Lee, H. M. Lee and E. J. Lavernia,

"The Effect of Heat Treatments and Si Contents on B2 Ordering Reaction in High Silicon Steels"

Materials Science and Engineering , vol. A307, no. 1-2, pp. 29-34 (2001).

47 J. S. Bae, J. H. Yu, H. M. Lee and B.-J. Lee,

"Assessment of the Mobilities of Mn in Fe-Mn and Ni-Mn Binary Systems"

Zeitschrift fur Metallkunde , vol. 91, no. 8, pp. 672-674 (2000).

46 W. K. Choi and H. M. Lee,

"Effect of Soldering and Aging Time on Interfacial Microstructure and Growth of Intermetallic Compounds between Sn-3.5Ag Solder Alloy and Cu Substrate"

Journal of Electronic Materials , vol. 29, no. 10, pp. 1207-1213 (2000).

45 S. R. Kim, S. K. Choi and H. M. Lee,

"Non-Steady-State Photovoltaic Current in (Pb0.85La0.15)TiO3 and BaTiO3 Ceramics"

Journal of Materials Research , vol. 15, no. 6, pp. 1354-1357 (2000).

44 S. W. Jeong, Z.-H. Lee and H. M. Lee,

"Effect of Si and Mn Additions on Ferrite and Austenite Phase Fractions in 25Cr-7Ni-1.5Mo-3W Base Super Duplex Stainless Steels (SDSS)"

Zeitschrift fur Metallkunde , vol. 91, no. 6, pp. 494-499 (2000).

43 J. Y. Lee, J. H. Kim and H. M. Lee,

"Effect of Mo and Nb on Phase Equilibrium of the Ti-Cr-V Ternary System in the Non-Burning Beta-Ti Alloy Region"

Journal of Alloys and Compounds , vol. 297, no. 1-2, pp. 231-239 (2000).

42 W. K. Choi, S. K. Choi and H. M. Lee,

"Relationship between Domain Structure and Film Thickness in Epitaxial PbTiO3 Films deposited on MgO(001) by Reactive Sputtering"

Journal of Materials Research , vol. 14, no. 12, pp. 4677-4684 (1999).

41 W. K. Choi and H. M. Lee,

"Effect of Ni Layer Thickness and Soldering Time on Intermetallic Compound Formation at the Interface between Molten Sn-3.5Ag and Ni/Cu Substrate"

Journal of Electronic Materials , vol. 28, no. 11, pp. 1251-1255 (1999).

40 J. Y. Lee, J. H. Kim, S. I. Park and H. M. Lee,

"Phase Equilibria of the Ti-Cr-V Ternary System in the Non-Burning Beta Ti-Rich Region"

Journal of Alloys and Compounds , vol. 291, no. 1-2, pp. 229-238 (1999).

39 S. W. Yoon, B.-S. Rho, H. M. Lee, C.-U. Kim and B.-J. Lee,

"Investigation of the Phase Equilibria in the Sn-Bi-In Alloy System"

Metallurgical and Materials Transactions A , vol. 30A, no. 6, pp. 1503-1515 (1999).

38 J.-R. Soh and H. M. Lee,

"Investigation of Thermodynamic Stability in the Phase Separating Thin Film using CVM"

Zeitschrift fur Metallkunde , vol. 90, no. 1, pp. 50-54 (1999).

37 S. W. Yoon, W. K. Choi and H. M. Lee,

"Interfacial Reaction between Sn-1Bi-5In-9Zn Solder and Cu Substrate"

Scripta Materialia , vol. 40, no. 3, pp. 327-332 (1999).

36 S. W. Yoon, W. K. Choi and H. M. Lee,

"Calculation of Surface Tension and Wetting Properties of Sn-based Solder Alloys"

Scripta Materialia , vol. 40, no. 3, pp. 297-302 (1999).

35 Y. K. Kim, J.-R. Soh, D. K. Kim and H. M. Lee,

"Glass Formation in Metallic Al-Ni-Y"

Journal of Non-Crystalline Solids , vol. 242, no. 2-3, pp. 122-130 (1998).

34 S. W. Yoon and H. M. Lee,

"A Thermodynamic Study of Phase Equilibria in the Sn-Bi-Pb Solder System"

CALPHAD , vol. 22, no. 2, pp. 167-178 (1998).

33 Y. K. Kim, J.-R. Soh, H. S. Kim and H. M. Lee,

"Thermodynamic Prediction of Glass Forming Range in Al-Mg-REM Ternary System"

CALPHAD , vol. 22, no. 2, pp. 221-230 (1998).

32 H. M. Lee, S. W. Yoon and B.-J. Lee,

"Thermodynamic Prediction of Interface Reaction Phases at Cu/Solder Joints"

Journal of Electronic Materials , vol. 27, no. 11, pp. 1161-1166 (1998).

31 M. K. Ahn, H.-S. Kwon and H. M. Lee,

"Quantitative Comparison of the Influences of W and Mo on the Passivity of Fe-29Cr Ferritic Stainless Steels"

Corrosion Science , vol. 40, no. 2/3, pp. 307-322 (1998).

30 H. M. Lee, J. S. Bae, J. R. Soh, S. K. Kim and Y. D. Lee,

"Diffusional Solidification Behavior in 304 Stainless Steel"

Materials Transactions, JIM , vol. 39, no. 6, pp. 633-639 (1998).

29 H. Lee, C. H. Yoo and H. M. Lee,

"The Effect of W Additions on Simulated Heat-Affected Zone Toughness in 25Cr-Base Super Duplex Stainless Steels"

Materials Science and Technology , vol. 14, no. 1, pp. 54-60 (1998).

28 H. M. Lee, H. Sohn and C. H. Yoo,

"Isothermal M2C Carbide Growth in Ultrahigh Strength High Co-Ni Steels"

Scripta Materialia , vol. 37, no. 12, pp. 1931-1937 (1997).

27 C.-U. Kim, J. W. Morris, Jr. and H. M. Lee,

"Kinetics of Electromigration-Induced Edge Drift in Al-Cu Thin-Film Interconnects"

Journal of Applied Physics , vol. 82, no. 4, pp 1592-1598 (1997).

26 S. I. Park, S. Z. Han, Z.-H. Lee and H. M. Lee,

"A Correction to Optimum Alloy Composition for Design of High-Temperature High-Strength Al-Ti-V-Zr Alloys through Thermodynamic Calculations"

Scripta Materialia , vol. 37, no. 1, pp. 93-97 (1997).

25 S. Z. Han, S. I. Park, J.-S. Huh, Z.-H. Lee and H. M. Lee,

"Lattice Matching of D023 and D022 Phases in Al-6at%(Ti,V,Zr) Systems"

Materials Science and Engineering , vol. 230A, no. 1, pp. 100-106 (1997).

24 B.-J. Lee, N.-M. Hwang and H. M. Lee,

"Prediction of Interface Reaction Products between Cu and Various Solder Alloys by Thermodynamic Calculation"

Acta Materialia , vol. 45, no. 5, pp. 1867-1874 (1997).

23 S. W. Yoon, J.-R. Soh, H. M. Lee and B.-J. Lee,

"Thermodynamics-Aided Alloy Design and Evaluation of New Pb-Free Solder, Sn-Bi-In-Zn System"

Acta Materialia , vol. 45, no. 3, pp. 951-960 (1997).

22 J.-R. Soh and H. M. Lee,

"Phenomenological Calculation of Phase Diagram of the Ni-Al System in the Ni-Rich Region"

Acta Materialia , vol. 45, no. 11, pp. 4743-4749 (1997).

21 S. I. Park, S. Z. Han, S. K. Choi and H. M. Lee,

"Phase Equilibria of Al3(Ti,V,Zr) Intermetallic System"

Scripta Materialia , vol. 34, no. 11, pp. 1697-1704 (1996).

20 C. H. Yoo, H. M. Lee, J. W. Chan and J. W. Morris, Jr.,

"M2C Precipitates in Isothermal Tempering of High Co-Ni Secondary Hardening Steel"

Metallurgical and Materials Transactions A , vol. 27A, no. 11, pp. 3466-3472 (1996).

19 S. Z. Han, B. S. Rho, H. M. Lee and S. K. Choi,

"Effect of Alloyed Ti:Zr Ratio on Phase Stability of Al66Mn9(Ti,Zr)25 Intermetallic Compounds"

Intermetallics , vol. 4, no. 3, pp. 245-249 (1996).

18 S. C. Chung, S. Z. Han, H. M. Lee and H.-S. Kwon,

"Coarsening Phenomenon of L12 Precipitates in Rapidly Solidified Al-3at%(Ti,V,Zr) System"

Scripta Metallurgica et Materialia , vol. 33, no. 5, pp. 687-693 (1995).

17 S. Z. Han, S. C. Chung and H. M. Lee,

"Alloy Design and Coarsening Phenomenon of L12 Precipitates in High-Temperature Al-2at%(Ti,V,Zr) Systems"

Metallurgical and Materials Transactions A , vol. 26A, no. 7, pp. 1633-1639 (1995).

16 S. Z. Han, H. M. Lee and H.-S. Kwon,

"Bonding Structure and Optical Bandgap of rf-Sputtered Hydrogenated Amorphous Silicon Carbide Alloy Films"

Journal of Non-Crystalline Solids , vol. 170, no. 2, pp. 199-204 (1994).

15 J.-R. Soh, H. M. Lee and H.-S. Kwon,

"Thermodynamic Evaluation and Phase Diagram of the PbO-TiO2 System"

CALPHAD , vol. 18, no. 3, pp. 237-244 (1994).

14 H. M. Lee, J.-R. Soh, Z.-H. Lee and Y.-S. Kim,

"Effect of Alloying Composition on Volume Fraction of Beta Phase in Duplex Titanium Alloys"

Scripta Metallurgica et Materialia , vol. 29, no. 4, pp. 497-501 (1993).

13 H. Lee, S. Z. Han, H. M. Lee and Z.-H. Lee,

"Coarsening Behavior of L12 Precipitates in Melt-Spun Al-Ti-V-Zr Alloys"

Materials Science and Engineering , vol. A163, no. 1, pp. 81-90 (1993).

12 J. W. Soh, H. M. Lee and H.-S. Kwon,

"Relation between Poisson's Ratio and Ionicity in Simple Binary Cubic Compounds"

Journal of Alloys and Compounds , vol. 194, no. 1, pp. 119-125 (1993).

11 J. W. Soh and H. M. Lee,

"Poisson's Ratios versus Ionicities of Metal-Nonmetal Compounds"

Scripta Metallurgica et Materialia , vol. 27, no. 7, pp. 783-788 (1992).

10 H. M. Lee,

"Design of Al3(Ti,V,Zr) Systems through Phase Stability Calculations"

Materials Science and Engineering , vol. A152, no. 1, pp. 26-30 (1992).

9 H. M. Lee,

"Interaction Parameters of Lead-Base Ternary Systems"

CALPHAD , vol. 16, no. 1, pp. 47-52 (1992).

8 H. M. Lee and H. Lee,

"Site Fraction Behavior of Transition Elements in Al3(Ti,V,Zr) Phase"

CALPHAD , vol. 16, no. 1, pp. 19-24 (1992).

7 H. M. Lee and W.-J. Lee,

"Poisson's Ratio of Pure Metals and their Non-Metallic Compounds"

Scripta Metallurgica et Materialia , vol. 25, no. 4, pp. 965-968 (1991).

6 H. M. Lee, A. J. Garratt-Reed and S. M. Allen,

"Composition of M2C Phase in Tempering of High Co-Ni Steels"

Scripta Metallurgica et Materialia , vol. 25, no. 3, pp. 685-688 (1991).

5 H. M. Lee, J. Lee and Z.-H. Lee,

"Lattice Misfit Variation of Al3(Ti,V,Zr) in Al-Ti-V-Zr Alloys"

Scripta Metallurgica et Materialia , vol. 25, no. 3, pp. 517-520 (1991).

4 H. M. Lee and S. M. Allen,

"Coarsening Resistance of M2C Carbides in Secondary Hardening Steels, Part III : Comparison of Theory and Experiment"

Metallurgical and Materials Transactions A , vol. 22A, no. 12, pp. 2877-2888 (1991).

3 H. M. Lee, S. M. Allen and M. Grujicic,

"Coarsening Resistance of M2C Carbides in Secondary Hardening Steels, Part II : Alloy Design aided by a Thermochemical Database"

Metallurgical and Materials Transactions A , vol. 22A, no. 12, pp. 2869-2876 (1991).

2 H. M. Lee, S. M. Allen and M. Grujicic,

"Coarsening Resistance of M2C Carbides in Secondary Hardening Steels, Part I : Theoretical Model for Multicomponent Coarsening Kinetics"

Metallurgical and Materials Transactions A , vol. 22A, no. 12, pp. 2863-2868 (1991).

1 H. M. Lee,

"Design of High-Temperature High-Strength Al-Ti-V-Zr Alloys"

Scripta Metallurgica et Materialia , vol. 24, no. 12, pp. 2443-2446 (1990).